Powder atomic layer deposition device and deposition method and application for same

Abstract

The invention belongs to the field of atomic layer deposition and discloses a powder atomic layer deposition device and a deposition method and application for the same. A heatable main cavity of thepowder atomic layer deposition device is fixed with a mechanical transmission shaft by a bearing, a powder growth bed is in clamped connection to the mechanical transmission shaft, a powder sample ispaved on the powder growth bed, and a vibrating rotation device is disposed on the upper end of the mechanical transmission shaft; a heatable gas pipeline is fixed on the left end of the heatable maincavity by a flange, and a powder filter is disposed at a joint between the heatable gas pipeline and the heatable main cavity; and the heatable gas pipeline is connected to an electromagnetic valve by a clamping sleeve, the electromagnetic valve is connected to a vacuum pump by the heatable gas pipeline, and a residual gas analyzer is disposed on the upper end of the electromagnetic valve. The device disclosed by the invention has the beneficial effects that an inlet source and air suction are configured on the same end; thin film growth efficiency is high, growth of different thin film materials is realized, and stability of the grown thin film materials is high; and overall device manufacture is simple, and utilization efficiency of a precursor source is increased.

Description

technical field [0001] The invention belongs to the technical field of atomic layer deposition, and in particular relates to a powder atomic layer deposition equipment and a deposition method and application thereof. Background technique [0002] At present, the existing technology adopts the growth process and equipment of uninterrupted pumping, which wastes the precursor source and the film growth efficiency is low; there are few types of films that can be grown, and the growth form is single; the powder loss rate is large, the structure is complex and the cost is high; The prior art mostly adopts the flow bed type, which has poor controllability. [0003] For the existing fluidized bed powder ALD growth equipment, the powder is in a fluid state. When the superfine powder is coated on the surface, a powder filter with ultra-small holes must be equipped at the lower end of the reaction chamber or the suction end, which will be extremely difficult. Large impact on the rate ...

AI Technical Summary

Problems solved by technology

[0006] (1) The current technology mostly adopts the flow bed type, which has poor controllability

[0007] (2) The existing technology adopts the growth process and equipment of uninterrupted pumping, which wastes the precursor source and the film growth efficiency is low; there are few types of films that can be grown, and the growth form is single

[0008] (3) In the equipment application of the prior art, the powder loss rate is relatively large, the structure is complex and the cost is high

[0011] How to achieve "stuffy" growth and ensure that the precursor is completely adsorbed on the surface of the powder to increase the yield has not been effectively solved.

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