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An airtight structure of miniaturized microwave components

An air-tight structure, microwave component technology, applied in electrical components, sealed enclosures, chassis/cabinet/drawer parts, etc., can solve the problems of thick microwave components, large volume, and unfavorable miniaturization design of microwave components. , to achieve the effect of thin thickness, small overall volume and good packaging effect

Active Publication Date: 2021-03-30
成都雷电微力科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to adopt the packaging structure of multi-layer cover plates for existing microwave components, resulting in thicker microwave components and larger volume, which is not conducive to the miniaturization design of microwave components and increases the technical problem of difficulty in the preparation of microwave components , providing an airtight structure for miniaturized microwave components

Method used

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  • An airtight structure of miniaturized microwave components
  • An airtight structure of miniaturized microwave components
  • An airtight structure of miniaturized microwave components

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Such as Figure 1-8 As shown, a miniaturized microwave assembly airtight structure includes a housing 1 and a cover 2, the housing 1 and the cover 2 are locked and connected by screws 4 to form a chamber 11 for installing a chip 3, so The cover plate 2 is embedded in the chamber 11 to close the chamber 11, and the opening position of the screw hole 5 corresponding to the screw 4 is provided with a welding groove 52, and a screw hole airtight member 6 is embedded in the welding groove 52 , so that the screw hole 5 is closed, the cover plate 2 and the housing 1 are welded by laser sealing, and the screw hole airtight part 6 and the welding groove 52 are welded by laser sealing.

[0035]The airtight structure of a miniaturized microwave component in this embodiment is preferably provided with a cover plate 2 that can be integrally embedded in the cavity 11 of the housing 1, so that the weld seam formed between the cover plate 2 and the housing 1 on the same plane, And the...

Embodiment 2

[0041] Such as Figure 1-8 As shown, the airtight structure of a miniaturized microwave component of this embodiment is the same as that of Embodiment 1, the difference is that: the bottom of the housing 1 is provided with a welding hole 12 for connecting the high and low frequency connector 8, and the cover After the board 2 is embedded in the chamber 11, at least one waveguide 9 is formed. The opening of the waveguide 9 is arranged on the cover plate 2, so that the opening direction of the waveguide 9 is in line with the microwave of the high-low frequency connector 8. The signal transmission direction is in the same normal direction, forming a vertical interconnection structure between the waveguide 9 and the high and low frequency connectors 8 .

[0042] The airtight structure of a miniaturized microwave component in this embodiment is used to weld the high and low frequency connector 8 by providing a welding hole 12 communicating with the chamber 11 on the housing 1. The ...

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Abstract

The present invention relates to the technical field of vertical interconnection of microwave circuits, in particular to an airtight structure of a miniaturized microwave component, including a housing and a cover plate, the housing and the cover plate are connected by screws to form a chamber, and the cover plate The cavity is embedded into the cavity to close the cavity, and the opening position of the screw hole corresponding to the screw is provided with a welding groove, and a screw hole airtight part is embedded in the welding groove, so that the screw hole is closed. The hole airtight part closes the opening position of the screw hole to realize the airtight sealing of the thread contact surface between the screw and the shell or the cover plate, so that the overall airtightness of the microwave component can be realized by using a single-layer cover plate, the thickness is thin, and the overall The small size realizes the miniaturization of the airtight structure. At the same time, each airtight position forms a plane weld, which is conducive to the airtight packaging of the microwave component through the mature packaging technology. The packaging effect is good, ensuring that the waveguide Excellent effect on transmission properties.

Description

technical field [0001] The invention relates to the technical field of vertical interconnection of microwave circuits, in particular to an airtight structure of a miniaturized microwave component. Background technique [0002] Microwave components are assembled using various microwave components and other parts, and are connected to external circuits in the form of coaxial, waveguide or other transmission lines. At the same time, high and low frequency connectors are also used for interconnection and shell structure packaging, and the air of the packaging structure Tightness is closely related to microwave transmission performance. If the package structure is poorly airtight, water vapor will condense in the package structure in high and low temperature environments, pollute the bare chip inside the microwave component, and affect the microwave transmission performance. [0003] At present, in the high-frequency microwave components that share the waveguide and high-low freq...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/00H05K5/02H05K5/06
CPCH05K5/0008H05K5/069H05K5/03
Inventor 韩家升冯琳管玉静
Owner 成都雷电微力科技股份有限公司
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