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Airtight TR module with both sides assembled with transceiver chips

A transceiver chip, airtight technology is applied in the structural field of a phased array antenna TR module, which can solve the problems of high preparation cost, many welding process steps, and long preparation time of the TR module, so as to reduce preparation time and cost, and reduce sealing Connector and soldering process, effect of easy preparation

Active Publication Date: 2019-06-21
成都雷电微力科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is: for the existing TR module, it is impossible to weld the chips on both sides of the module body, and only adopt the assembly method of welding the chips in the single-sided cavity of the single TR module, and the radio frequency link is separately packaged, resulting in the preparation of the TR module Due to the technical problems of high cost, many welding process steps, and long preparation time, an airtight TR module with double-sided assembly of transceiver chips is provided.

Method used

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  • Airtight TR module with both sides assembled with transceiver chips
  • Airtight TR module with both sides assembled with transceiver chips
  • Airtight TR module with both sides assembled with transceiver chips

Examples

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Effect test

Embodiment 1

[0031] Such as Figure 1-4 As shown, an airtight TR module with transceiver chips assembled on both sides includes a module body 1, and chambers 11 are respectively arranged on both sides of the module body 1, and a signal transmission path is arranged in the chamber 11, and the The signal transmission path includes a daughter board 3, a radio frequency power supply board 4 and a radio frequency link 2 connected in sequence, and the radio frequency link 2 includes several transceiver chips 21 connected by radio frequency transmission microstrips 22, and at least one radio frequency link 2 is arranged on the radio frequency Link carrier board 5.

[0032]In this embodiment, a kind of airtight TR module with transceiver chips assembled on both sides is preferably provided with chambers 11 on the front and back sides of the module body 1, and the two chambers 11 are respectively provided with a sub-board 3 and a radio frequency power supply board. 4 and the signal transmission pa...

Embodiment 2

[0039] Such as Figure 1-4 As shown, an airtight TR module with double-sided assembly of transceiver chips in this embodiment has the same structure as that of Embodiment 1, the difference is that the chamber 11 is nested and fitted with the chamber 11 through the cover plate 12 Airtight sealing, the nesting fit is to set a step matching the cover plate 12 at the opening of the chamber 11, so that the cover plate 12 is embedded in the step of the opening of the chamber 11, and formed on the surface of the module body 1 on the opening side of the chamber 11 Weld 14.

[0040] In this embodiment, an airtight TR module with double-sided assembly of transceiver chips realizes the overall airtight sealing of the TR module through the nested cover plate 12 and the chamber 11, combined with the welding process, and the nested and fitted cover plate 12 Form a welding seam 14 on the surface of the module body 1 on the opening side of the chamber 11 with the cavity 11, and hermetically ...

Embodiment 3

[0042] Such as Figure 1-4 As shown, the airtight TR module of a double-sided assembled transceiver chip of this embodiment has the same structure as that of Embodiment 2, the difference is that the sub-board 3 is connected to the radio frequency power supply board 4 with gold wires, and the radio frequency The power supply board 4 is electrically connected to the radio frequency link 2, and the radio frequency transmission microstrips 22 are connected by gold wires.

[0043] An airtight TR module with double-sided assembly transceiver chips in this embodiment, the sub-board 3 and the RF power supply board 4 are connected by gold wires, and the RF transmission microstrips 22 are connected by gold wires, preferably RF power supply The gold wire connection between the board 4 and the radio frequency link 2 makes the gold wire connection replace the connection method of the original airtight connector, reduces the process steps of opening precision stepped holes in the module bod...

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Abstract

The invention relates to the technical field of structures of phased array antenna TR modules, and more particularly to an airtight TR module with both sides assembled with transceiver chips. The hermetic TR module comprises a module body, wherein chambers are disposed on both sides of the module body, signal transmission paths including a plurality of transceiver chips are disposed in the chambers, and the transceiver chips of at least one signal transmission path are disposed on a radio frequency link carrier such that the transceiver chips on both sides of the module body are separately assembled and soldered to the surfaces of different parts when manufacturing the TR module, which facilitates the heating and temperature leveling during welding, improves the welding quality, facilitates the rework of the TR module, realizes the reliability of assembling the transceiver chips on both sides of the TR module, facilitates the airtight sealing of the entire chambers to realize the overall airtightness of the TR module, reduces the sealing connectors and soldering process between the airtight portion and the non-airtight portion of the existing TR module and reduces the preparation time and cost of the TR module.

Description

technical field [0001] The invention relates to the structural technical field of a phased array antenna TR module, in particular to an airtight TR module with transceiver chips assembled on both sides. Background technique [0002] The TR module of the existing structure generally includes a module body, a radio frequency link and a sub-board, wherein the radio frequency link is generally packaged separately to form a small module and then installed on the module body or packaged in a cavity provided on one side of the module body, and the sub-board part No hermetic packaging is performed, and connections are made between the daughter board and the radio frequency communication interface, and between the daughter board and the radio frequency link through airtight connectors. [0003] For the TR module of the existing structure, if chambers are provided on both sides of the module body for encapsulating the radio frequency link, the heating surface generally cannot directly...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q21/06H01Q1/00H01Q21/00H04B1/40
Inventor 夏辉吴凤鼎管玉静
Owner 成都雷电微力科技股份有限公司
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