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Integrated micro cavity-based spectral detection chip and reconstruction method

A spectral detection and integrated microcavity technology, applied in the field of integrated microcavity spectral detection chips, can solve the problems of detector chip damage, complex process, and difficulty in restoring the spectral solution of the sample, avoiding irreversible damage and ensuring resolution. Effect

Inactive Publication Date: 2019-07-19
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1. The production of multi-channel filters requires repeated engraving, and the process is complicated;
[0007] 2. Etching directly on the detector chip will cause irreversible damage to the original detector chip due to the impact of ion bombardment;
[0008] 3. The solution obtained by calculating the pseudo-inverse through the full-rank decomposition of the non-negative matrix is ​​the minimum second-order norm solution of the equation. However, the minimum second-order norm solution is not the sample spectral solution in general, and it is also very easy to use filtering and other means afterward. It is difficult to restore the sample spectral solution

Method used

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  • Integrated micro cavity-based spectral detection chip and reconstruction method
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  • Integrated micro cavity-based spectral detection chip and reconstruction method

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Embodiment 1

[0041] In this embodiment, we demonstrate a spectral detection chip in the visible light band and a method for fabricating a stepped intermediate cavity layer by using ultraviolet nanoimprinting technology.

[0042] Chip-scale spectrometer structure such as figure 1 As shown, among them: 1 is an ordinary array detector, where black and white CCD chips are selected; 2 is the first dielectric high-reflection film, and the material selected is Ta 2 o 5 and SiO 2 ; 3 is a two-dimensional stepped intermediate cavity layer made by ultraviolet nanoimprinting technology; 4 is a second dielectric high-reflection film, and the selected material is Ta 2 o 5 and SiO 2 ; 5 is a bandpass filter.

[0043] Dielectric reflection film 2 structure is: λ=633nm, H-Ta 2 o 5 ,L-SiO 2 , (LH) 5 1.4L.

[0044] Dielectric reflection film 4 structure is: λ=633nm, H-Ta 2 o 5 ,L-SiO 2 , (HL) 5 .

[0045] The stepped intermediate cavity layer 3 is a two-dimensional grid stepped dielectric la...

Embodiment 2

[0058] In this embodiment, we demonstrate a spectral detection chip in the visible light band and a method for fabricating a stepped intermediate cavity layer by thermal nanoimprinting technology.

[0059] Chip-scale spectrometer structure such as figure 1 As shown, among them: 1 is an ordinary array detector, where black and white CCD chips are selected; 2 is the first dielectric high-reflection film, and the material selected is Ta 2 o 5 and SiO 2 ; 3 is a two-dimensional stepped intermediate cavity layer made by ultraviolet nanoimprinting technology; 4 is a second dielectric high-reflection film, and the selected material is Ta 2 o 5 and SiO 2 ; 5 is a bandpass filter.

[0060] Dielectric reflection film 2 structure is: λ=633nm, H-Ta 2 o 5 ,L-SiO 2 , (LH) 5 1.4L.

[0061] Dielectric reflection film 4 structure is: λ=633nm, H-Ta 2 o 5 ,L-SiO 2 , (HL) 5 .

[0062] The stepped intermediate cavity layer 3 is a two-dimensional grid stepped dielectric layer. In th...

Embodiment 3

[0075] In this embodiment, we demonstrate a spectral detection chip in the infrared band and a method for fabricating a stepped intermediate cavity layer by using ultraviolet nanoimprinting technology.

[0076] Chip-scale spectrometer structure such as figure 1 As shown, among them: 1 is the infrared area detector, and the low-temperature mercury cadmium telluride infrared detector chip is used here; 2 is the first dielectric high-reflection film, and the materials are Si and SiO; 3 is the ultraviolet nanoimprint technology middle cavity layer; 4 is the second dielectric high-reflection film, and the selected materials are Si and SiO; 5 is a bandpass filter.

[0077] Detector 1 uses the MARS MW detector chip and corresponding components from Sofradia, France.

[0078] Dielectric reflection film 2 structure is: λ=3833nm, H-Si, L-SiO, (LH) 5 1.4L.

[0079] Dielectric reflection film 4 structure is: λ=3833nm, H-Si, L-SiO, (HL) 5 .

[0080] The stepped intermediate cavity la...

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Abstract

The invention discloses an integrated micro cavity-based spectral detection chip and a reconstruction method. According to the spectral detection chip, a multichannel integrated beam splitting structure is made on a common array detector chip through a nano imprinting technology and a coating technology, so that the responses, to incident light, of different pixels on the original detector chip are different; and a spectral reconstruction method is utilized to restore a sample spectrum. The spectral detection chip integrates the beam splitting and detection, so that the detector has spectral resolution ability, and a chip-level spectral instrument is realized; and the spectral detection chip has the advantages of being small in volume, low in cost, high in resolution and convenient to make, and has an important application value in the field of spectral analysis.

Description

technical field [0001] The invention relates to the technical field of spectrum measuring instruments, in particular to a spectrum detection chip, in particular to an integrated microcavity spectrum detection chip based on the principle of multi-channel Fabry-Perot spectroscopy. Background technique [0002] Spectroscopy is an important interdisciplinary subject mainly involving physics and chemistry. People can analyze the composition and structure of substances through the changes in the spectrum before and after the interaction between light and matter. Due to the advantages of fast speed, high efficiency, low cost, and good reproducibility, spectral analysis is widely used in exhaust gas analysis, crop production testing, atmospheric testing, food testing, drug testing, clinical disease testing, commodity identification, etc. field. [0003] At present, most of the spectrometers on the market are based on the principles of prism spectroscopy, grating spectroscopy or Fou...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J3/28G01J3/02
CPCG01J3/0205G01J3/2803
Inventor 王少伟刘清权颜炎洪陈旭陆卫
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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