Semiconductor device and method for manufacturing same

Abstract

The invention provides a semiconductor device and a method for manufacturing the same, wherein the solderability of a pin part of the semiconductor device without a pin is ensured. A DFN (6) is provided with a semiconductor chip; a die pad; a plurality of pin parts (2a) arranged around the die pad and having notches (2c) formed at the tips of the pin parts; and a plurality of leads which electrically connect the surface electrode of the semiconductor chip and one of the plurality of pin parts (2a), and a resin sealing body (4) which covers the semiconductor chip and a part of each of the plurality of pin parts (2a). Furthermore, each of the plurality of pin parts (2a) has a terminal part (2b) exposed on the back surface (4b) of the sealing body (4), and the width of the cutout part (2c) inthe direction along the arrangement direction (P) of the plurality of pin parts (2a) is smaller than the width of the terminal part (2b) in the direction along the arrangement direction (P).

Description

technical field [0001] The present invention relates to, for example, a leadless type semiconductor device and its manufacturing technology. Background technique [0002] A method of manufacturing a semiconductor device called MAP (Mold Array Package) is known. In this method, a sealing body is used to uniformly cover a plurality of device regions, and dicing is performed for each sealing body (package dicing: Package Dicing). Monolithic. [0003] As a method of manufacturing MAP, for example, US Patent No. 8017447 specification (Patent Document 1) discloses a technique of overmolding a lead frame (Lead Frame) connected to an adjacent structure and formed with a connecting rod. , to remove the molding material filling the groove by irradiating laser light on the groove in which the connecting rod is formed. [0004] In addition, for example, JP-A-2013-143445 (Patent Document 2) discloses a technique of irradiating laser beams to leads exposed from the lower surface of a se...

AI Technical Summary

Problems solved by technology

[0009]Leadless package is singulated by cutting the lead terminals and mold compound (MoldCompound) with a dicing saw, so although the lead terminals The lower surface of the lead terminal is covered with a solder-wetting material, but the side of the lead terminal is not covered with a solder-wetting material. When thermally mounting the mounting substrate with a solder material, the connection reliability of the outer lower end of the side lead is poor. In addition, , visual inspection of solder joints is also difficult

[0010] That is, after overmolding the outer lower portion of the side pins with molding compound (to form a step at the tie bar of the lead frame), the Removal of the molding compound does not completely remove the molding compound, and the subsequent coverage of the solder-wetting material becomes uneven, making it difficult to ensure solderability

[0011] In addition, when using a laser to remove the mold compound, due to the laser on the outer lower end of the side pin Excessive exposure, thus creating cavitated parts of the molded resin on both sides of the terminal, which may deteriorate moisture resistance

Images