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Zero discharge treatment process of industrial cleaning waste water

An industrial cleaning and treatment process technology, applied in the field of water treatment, can solve the problem of no better treatment method for wastewater, achieve the effects of reducing organic pollution, improving operation stability, and reducing organic pollution

Active Publication Date: 2019-07-12
济南上华科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] In order to solve the problem that there is no better treatment method for a large amount of waste water generated during the process of removing pollutants and self-oxides on the surface of silicon wafers, the invention discloses a treatment method for cleaning waste liquid. On the one hand, the method can effectively recover solids such as silicon powder, on the other hand, it can effectively recycle the active ingredients in the cleaning solution, and at the same time, it can also achieve the effect of zero discharge of the entire cleaning solution

Method used

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  • Zero discharge treatment process of industrial cleaning waste water
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  • Zero discharge treatment process of industrial cleaning waste water

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] The cleaning waste liquid on the surface of the cut silicon wafer is first subjected to natural sedimentation treatment. The large particle silicon powder obtained at the bottom and the sedimentation supernatant are sent to the ozone reaction tank, and treated at 40°C and 1200-1500ppm concentration of ozone for 40 minutes, and then Send it to the oil-water-solid three-phase cyclone separator for separation treatment. In the separator, the flow rate of the feed is adjusted to 5min / s. The top is the oil phase outlet, the side is the solid phase outlet, and the bottom is the water phase outlet. The pressure at the outlet is 0.5MPa, the pressure at the outlet of the solid phase is 0.1MPa, and the volume ratio of the materials at the outlet of the oil phase, the outlet of the solid phase and the outlet of the water phase is adjusted to 1:3:20, and the oil phase at the top is sent to the biochemical system for further processing. Degradation treatment, the silicon powder with ...

Embodiment 2

[0055] The cleaning waste liquid on the surface of the cut silicon wafer is first subjected to natural sedimentation treatment. The large particle silicon powder obtained at the bottom and the sedimentation supernatant are sent to the ozone reaction tank, and treated at 35°C and 1200-1500ppm concentration of ozone for 50 minutes, and then Send it to the oil-water-solid three-phase cyclone separator for separation treatment. In the separator, the flow rate of the feed is adjusted to 8min / s. The top is the oil phase outlet, the side is the solid phase outlet, and the bottom is the water phase outlet. The pressure at the outlet of the solid phase is 0.6MPa, the pressure at the outlet of the solid phase is 0.2MPa, and the volume ratio of the materials at the outlet of the oil phase, the outlet of the solid phase and the outlet of the water phase is adjusted to 1: 5: 25, and the oil phase at the top is sent to the biochemical system for further processing. Degradation treatment, the...

Embodiment 3

[0057] The cleaning waste liquid on the surface of the cut silicon wafer is first subjected to natural sedimentation treatment. The large particle silicon powder obtained at the bottom and the sedimentation supernatant are sent to the ozone reaction tank, and are treated at 45°C and 1200-1500ppm concentration of ozone for 30 minutes, and then Send it to the oil-water-solid three-phase cyclone separator for separation treatment. In the separator, the flow rate of the feed is adjusted to 6min / s. The top is the oil phase outlet, the side is the solid phase outlet, and the bottom is the water phase outlet. The pressure at the outlet is 0.56MPa, the pressure at the outlet of the solid phase is 0.16MPa, and the volume ratio of the materials at the outlet of the oil phase, the outlet of the solid phase and the outlet of the water phase is adjusted to 1:4:22, and the oil phase at the top is sent to the biochemical system for further processing. Degradation treatment, the silicon powder...

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Abstract

The invention relates to a zero discharge treatment process of industrial cleaning waste water, belonging to the technical field of water treatment. In order to solve the problem that there is no better treatment method for the large amount of waste water produced in the process of removing pollutants and self-oxides from the surface of silicon wafer, the invention discloses a method for treatingcleaning waste liquid. On one hand, the method can effectively recover solids such as silicon powder, on the other hand, the effective components in the cleaning liquid can be effectively recovered and utilized, and at the same time, the effect of zero discharge of the entire cleaning liquid can be realized.

Description

technical field [0001] The invention relates to a zero-discharge treatment process for industrial cleaning wastewater, belonging to the technical field of water treatment. Background technique [0002] Silicon wafer cleaning refers to the use of physical or chemical methods to remove pollutants and self-oxides on the surface of silicon wafers before oxidation, photolithography, epitaxy, diffusion, and wire evaporation, so as to obtain silicon wafer surfaces that meet the cleanliness requirements. process. In silicon wafer processing technology, as many as 20% of the steps are cleaning. Therefore, in the process of industrial production, a large amount of cleaning wastewater will be produced. In the case of increasingly tight water resources and increasing environmental protection requirements, how to effectively treat the wastewater from these cleaning processes with zero discharge is particularly critical. [0003] In the prior art, a water-based cleaning solution is ge...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C02F9/14
CPCC02F1/001C02F1/38C02F1/40C02F1/442C02F1/78C02F3/30C02F9/00C02F2001/007
Inventor 孙小刚李志虎王杨
Owner 济南上华科技有限公司
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