Composite magnetic field and lining bias voltage tapered tube composite type filtered arc ion plating
An arc ion plating and arc plasma technology, which is applied in the field of material surface treatment, can solve the problems of pollution, uniform ablation of the target material, large particle defects, etc., to ensure the uniformity, improve the utilization efficiency, and achieve the effect of effective control
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specific Embodiment approach 1
[0020] Specific implementation mode one: the following combination figure 1 , 2 and 3 illustrate the present embodiment, the present embodiment combines the magnetic field and the arc ion plating of the liner bias conical tube compound filter to use the device including the bias power supply (1), the arc power supply (2), the arc ion plating target source ( 3), multi-stage magnetic field device (4), multi-stage magnetic field power supply (5), lined bias conical tube device (6), lined bias power supply (7), movable coil device (8), movable coil device Power supply (9), rheostat device (10), sample stage (11), bias power supply waveform oscilloscope (12) and vacuum chamber (13);
[0021] In this device:
[0022] The substrate workpiece to be processed is placed on the sample stage (11) in the vacuum chamber (13), the multi-stage magnetic field device (4), the lined bias conical tube device (6), the movable coil device (8) and the vacuum chamber ( 13) are insulated from each ...
specific Embodiment approach 2
[0036] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the device can also realize other functions: it can combine traditional DC magnetron sputtering, pulse magnetron sputtering, traditional arc ion plating and pulse cathode arc Combination of one or more than two methods, and then apply DC bias, pulse bias, DC pulse composite bias or bipolar pulse bias device on the workpiece for thin film deposition to prepare pure metal thin films and compounds with different element ratios Ceramic films, functional films and high-quality films with nano-multilayer or gradient structures.
specific Embodiment approach 3
[0037] Embodiment 3: The difference between this embodiment and Embodiment 2 is that the combined magnetic field is connected to the arc ion plating of the compound type filter of the lined bias conical tube, the arc power supply (2) is turned on, and the multi-stage magnetic field power supply ( 5) Adjust the multi-level magnetic field device (4), turn on the liner bias power supply (7), the liner bias conical tube device (6) maintains a positive DC bias, turn on the bias power supply (1), and turn on the movable coil device The power supply (9) adjusts the movable coil device (8), adjusts the output resistance of the rheostat device (10), adjusts the process parameters, conducts film deposition, and prepares multi-layer structure films with different stress states, microstructures and element ratios, and other related implementation Method 2 is the same.
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