Regular hexagonal micron chip capacitor material formed by interwoven NiCoP-CoP porous nanowires and preparation method
A technology of regular hexagons and nanowires, which is applied in the field of preparation of supercapacitor electrode materials, can solve the problems of low hydroxide conductivity, high specific capacitance, and unreachability, and achieve good repeatability, strong applicability, and easy operation Effect
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Embodiment 1
[0027] Preparation of regular hexagonal microsheets composed of NiCoP-CoP microporous nanowires interlaced: 320mg nickel nitrate hexahydrate, 640mg cobalt nitrate hexahydrate, 245mg ammonium fluoride and 991mg urea were dissolved in 40mL deionized water in sequence, and magnetically stirred for 20min ; The mixed solution was transferred to a 50mL reactor, reacted at 120°C for 8h, the reaction product was washed by centrifugation, and dried at 60°C for 12h to obtain a Ni-Co precursor. Then, take 100 mg of precursor and 1000 mg of sodium hypophosphite and place them on both ends of the porcelain boat and place them in a tube furnace. Under the protection of inert gas N2, set the temperature rise program at 2°C / min to 300°C, and react at high temperature for 2 hours. Then the temperature was naturally lowered, and finally the reaction product was centrifugally cleaned, and dried at 60° C. for 12 hours to obtain the final product (composite material of nickel cobalt phosphide and c...
Embodiment 2
[0032] The molar ratio of the reagents nickel nitrate hexahydrate and cobalt nitrate hexahydrate used to prepare the Ni-Co precursor was adjusted to 2:3, and other conditions were the same as in Example 1.
Embodiment 3
[0034] The molar ratio of the reagents nickel nitrate hexahydrate and cobalt nitrate hexahydrate used to prepare the Ni-Co precursor was adjusted to 1:1, and other conditions were the same as in Example 1.
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