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Thermosetting resin composition and prepreg and laminated board prepared by applying same

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, chemical instruments and methods, layered products, etc., can solve the problems of poor adhesion, low glass transition temperature, low strength, etc.

Active Publication Date: 2019-06-28
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a large number of studies have shown that although hydrocarbon resins can provide good dielectric properties, due to the flexibility and non-polar carbon chain structure of hydrocarbon resins, hydrocarbon resins have insufficient rigidity, low strength, and poor heat resistance after curing. , low glass transition temperature, poor adhesion and other problems, there are still many problems to be solved in practical applications

Method used

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  • Thermosetting resin composition and prepreg and laminated board prepared by applying same
  • Thermosetting resin composition and prepreg and laminated board prepared by applying same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0081] Put 1000g of tetrahydrofuran, 100g of dicyclohexylcarbodiimide, 58.8g of maleic anhydride, and 228g of bisphenol A into the three-necked reaction flask, fully dissolve them, put them in the three-necked reaction flask and mix them thoroughly, and then add a catalytic amount of 4-dimethylaminopyridine, reacted at room temperature for 5 hours, then separated and purified the product to obtain active ester resin A-1, and the hydroxyl functional group equivalent in the active ester (A-1) resin was calculated as 690 grams / equivalent based on the input ratio (58.8+228-18*0.6=276, 276 / 0.4=690), the ester group functional equivalent is 230 g / equivalent based on the input ratio, and the unsaturated double bond functional equivalent is 460 g / equivalent.

[0082] In a flask equipped with a thermometer, dropping funnel, condenser, shunt pipe, and stirrer, put 1000 g of methyl isobutyl ketone into the solvent, then take 276 g of resin A-1 and put it into the flask to fully dissolve. ...

Synthetic example 2

[0084] Put 1000g of tetrahydrofuran, 100g of dicyclohexylcarbodiimide, 58.8g of maleic anhydride, and 160g of 2,7 dihydroxynaphthalene into the three-neck reaction flask, fully dissolve them, mix them fully in the three-neck reaction flask, and then add A catalytic amount of 4-dimethylaminopyridine was reacted at room temperature for 5 hours, and then the product was separated and purified to obtain an active ester resin (A-2), and the hydroxyl functional group equivalent in the active ester (A-2) resin was calculated based on the input ratio It is 520 g / equivalent (58.8+160-18*0.6=208, 208 / 0.4=520), the ester group functional equivalent is 173 g / equivalent based on the input ratio, and the unsaturated double bond functional equivalent is 347 g / equivalent.

[0085] In a flask equipped with a thermometer, dropping funnel, condenser, shunt pipe, and stirrer, put 1000 g of solvent methyl isobutyl ketone, then take 208 g of resin A-2 into the flask, and fully dissolve it. Nitrogen...

Embodiment 1～7 and comparative example 2～3

[0090] According to the formula shown in Table 1, it is first necessary to prepolymerize the unsaturated polyester active ester, ethylenic monomer, and initiator in Example 5 into a prepolymer according to the method of Example 1, and the unsaturated polyester in Example 6 Polyester active ester, ethylenic monomer, initiator are prepolymerized into prepolymer according to the method of embodiment 2. Examples 3-4, Example 7 and Comparative Examples 2 and 3 did not carry out pre-polymerization, but ordinary physical blending, which will not be specifically described here.

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PUM

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Abstract

The invention discloses a thermosetting resin composition which is prepared from the following components in parts by weight: (a) 100 parts of epoxy resin, (b) 50-200 parts of unsaturated polyester active ester resin, (c) 10-200 parts of vinyl modified polyphenyl ether ester, and (d) 0.05-4 parts of an accelerant. The unsaturated polyester active ester resin can combine an active ester cured epoxyresin system, a hydrocarbon resin curing system and a polyphenyl ether system effectively by means of chemical bonds and combine excellent performance of the active ester cured epoxy resin system, the hydrocarbon resin curing system and the polyphenyl ether system effectively, so that the resin composition which is cured has excellent dielectric property, heat resistance, strength, stiffness andflexibility, high peel strength, low water absorption and small heat shrinkage, and can be applied to high speed and high frequency printed circuit boards.

Description

technical field [0001] The invention relates to a thermosetting resin composition and a prepreg and a laminate prepared by using the composition, belonging to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in terms of dielectric properties. To put it simply, printed circuit substrate materials need to have lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, expect to provide a kind of thermosetting resin composition, the printed circuit board material that uses this thermosetting resin composition to make can show sufficiently low low dielectric constant and low dielectric consta...

Claims

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Application Information

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IPC IPC(8): C08L67/06C08L63/00C08L71/12C08G63/52C08J5/24C08F283/01C08F212/08C08F283/10C08F283/06B32B15/092B32B27/04
Inventor 何继亮陈诚王宁黄荣辉马建崔春梅储正振
Owner SHENGYI TECH SUZHOU
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