Circuit board connecting finger laser cutting method and system

Abstract

The invention relates to a circuit board connecting finger laser cutting method and system. The method comprises the steps that an inter-finger insulating layer removal laser beam and a connecting finger cutting laser beam are protected to a circuit board to-be-cut area for scanning processing, the laser peak power density of projection laser spots, in a finger insulating layer to-be-cut area, ofthe inter-finger insulating layer removal laser beam is smaller than the laser processing threshold value of a connecting finger material and is larger than or equal to the laser processing thresholdvalue of an inter-finger insulating layer material, and the laser peak power density of projection laser spots, in a connecting finger to-be-cut area, of the connecting finger cutting laser beam is larger than or equal to the laser processing threshold value of the connecting finger material; and the inter-finger insulating layer removal laser beam is used for enabling a cavity to be formed in theinter-finger insulating layer to-be-cut area through processing, the connecting finger cutting laser beam is used for enabling a kerf to be formed on a circuit board through processing, and the edgesof the two sides of the cavity are located on the outer sides of the two side edges of the kerf correspondingly. According to the technical scheme, the problem that a micro short circuit fault occursto a connecting finger when the circuit board is subjected to laser cutting can be solved.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a gold finger laser cutting method and system for circuit boards. Background technique [0002] The increasing demand for portable electronic products has driven the development of circuit boards from single-sided to double-sided, multi-layer, flexible and rigid-flexible boards, and continues to develop in the direction of high precision, high density and high reliability. The base material of the flexible circuit board (FPC board) is copper, and it needs to be covered with a layer of cover film on the circuit board substrate. The material of the cover film is generally polyimide. Combined with the circuit board substrate surface to play a protective role. In the later stage of FPC board production, the shape needs to be processed, and there is a row of golden fingers on the shape to connect with other electronic products. [0003] The so-called gold fingers, also know...

AI Technical Summary

Problems solved by technology

However, traditional CNC machining and die stamping are difficult to meet the die-cutting requirements. The lines of the gold fingers are densely distributed, and a slight deviation in the position will cause the gold fingers to be misaligned in the connection, which will lead to abnormal signal communication of the gold fingers, and thus make good products rate is not high

[0005] At present, the industry mainly adopts the method of laser cutting gold fingers, but for this kind of high-density gold fingers, whether it is ultraviolet nanosecond laser or ultra-short pulse laser, due to the different interaction mechanisms between polyimide and copper foil and laser, resulting in copper The threshold value of foil laser processing is much higher than that of polyimide, and there is a problem of carbonization of the insulating material of the gold finger, which causes a micro-short circuit between the fingers of the gold finger, affecting the quality of the gold finger and even electronic equipment

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