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High-temperature-resistant high-molecular conductive composite material

A technology of polymer conductive and composite materials, applied in the field of polymer conductive composite materials, can solve problems such as high temperature resistance, and achieve the effects of prolonging the service life, increasing the degree of compatibility, and being beneficial to use.

Inactive Publication Date: 2019-06-25
安徽律正科技信息服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the shortcoming of the polymer conductive composite material in the prior art that is not resistant to high temperature, and propose a high temperature resistant polymer conductive composite material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A high temperature-resistant polymer conductive composite material, which is composed of the following raw materials in the weight ratio: 40 parts of high molecular polymer base material, 15 parts of conductive filler, 5 parts of nano-ceramic particles, 1 part of flame retardant, polyethylene glycol 0.5 parts of a mixture of polyethylene wax with a mass ratio of 1:1; the polymer base material is a mixture of polycaprolactone, polylactic acid, and epoxy resin with a mass ratio of 1:1:1; the composition percentage of conductive filler It is 35% nano-silver superfine powder, 5% nano-gold superfine powder, 40% modified carbon fiber, 18% nano-nickel powder, and 2% graphene.

[0017] A method for preparing a high-temperature-resistant high-molecular conductive composite material, comprising the following steps: weighing a formula amount of high-molecular polymer base material, conductive filler, nano-ceramic particles, flame retardant, polyethylene glycol, and polyethylene wax...

Embodiment 2

[0019] A high temperature-resistant polymer conductive composite material, which is composed of the following raw materials in the weight ratio: 55 parts of high molecular polymer base material, 20 parts of conductive filler, 8 parts of nano-ceramic particles, 2 parts of flame retardant, polyethylene glycol 0.8 parts of a mixture of polyethylene wax with a mass ratio of 1:1; the polymer base material is a mixture of polycaprolactone, polylactic acid, and epoxy resin with a mass ratio of 1:1:1; the composition percentage of conductive filler It is 35% nano-silver superfine powder, 5% nano-gold superfine powder, 40% modified carbon fiber, 18% nano-nickel powder, and 2% graphene.

[0020] A method for preparing a high-temperature-resistant high-molecular conductive composite material, comprising the following steps: weighing a formula amount of high-molecular polymer base material, conductive filler, nano-ceramic particles, flame retardant, polyethylene glycol, and polyethylene wa...

Embodiment 3

[0022] A high-temperature-resistant high-molecular conductive composite material, which is composed of raw materials in the following weight ratio: 50 parts of high-molecular polymer base material, 18 parts of conductive filler, 6 parts of nano-ceramic particles, 1 part of flame retardant, polyethylene glycol 0.7 parts of a mixture of polyethylene wax with a mass ratio of 1:1; the polymer base material is a mixture of polycaprolactone, polylactic acid, and epoxy resin with a mass ratio of 1:1:1; the composition percentage of conductive filler It is 35% nano-silver superfine powder, 5% nano-gold superfine powder, 40% modified carbon fiber, 18% nano-nickel powder, and 2% graphene.

[0023] A method for preparing a high-temperature-resistant high-molecular conductive composite material, comprising the following steps: weighing a formula amount of high-molecular polymer base material, conductive filler, nano-ceramic particles, flame retardant, polyethylene glycol, and polyethylene ...

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PUM

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Abstract

The invention belongs to the technical field of high molecular material, and especially relates to a high-temperature-resistant high-molecular conductive composite material. The high-temperature-resistant high-molecular conductive composite material is composed of, by weight, 40 to 55 parts of a high-molecular polymer base material, 15 to 20 parts of a conductive filler, 5 to 8 parts of an inorganic filler, 1 to 2 parts of a flame retardant, and 0.5 to 0.8 part of a dispersant. The method comprises the following steps: the high-molecular polymer base material, the conductive filler, the inorganic filler, the flame retardant and the dispersant are weighed at the formula ratio, and are mixed to be uniform so as to obtain a premixed raw material; melt blending and extruding are carried out soas to obtain the high-temperature-resistant high-molecular conductive composite material. According to a preparation method, the high-molecular polymer base material and the conductive filler are taken as main raw materials, and the flame retardant and the dispersant are added to provide the high-temperature-resistant high-molecular conductive composite material with high temperature resistance characteristic, and the compatibility degree of the various raw materials is increased; the adopted materials are nanometer grade particles, so that the conductivity is increased to a high degree, it is convenient for using, and the service life of the high-temperature-resistant high-molecular conductive composite material is prolonged.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a high temperature resistant polymer conductive composite material. Background technique [0002] The positive temperature coefficient thermistor based on polymer conductive composite material can change the resistivity of PTC by several orders of magnitude before and after the critical transition temperature, that is, the resistance of PTC can increase with the ambient temperature of its use. And increase, so that the current can be reduced or cut off at a higher temperature to protect against over-current and over-temperature. At present, this type of device has been widely used in various circuit protection devices, such as lithium-ion batteries, automobile motors, etc. [0003] Generally, polymer conductive composite materials are compounded by crystalline or semi-crystalline polymer materials and conductive fillers through extrusion calendering or banburying-tablet...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/04C08L63/00C08K13/06C08K9/02C08K7/06C08K3/08C08K3/04
Inventor 魏刚
Owner 安徽律正科技信息服务有限公司
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