Micro-channel jet radiator

Abstract

The invention discloses a micro-channel jet radiator. A cover plate is arranged on a heat conduction substrate to form a box-shaped body with an inner cavity; a partition plate is horizontally arranged in the inner cavity, and the inner cavity is divided into an upper liquid inlet cavity and a lower liquid outlet cavity; jet holes are distributed in the partition plate; pits are distributed in thelower liquid outlet cavity and located in the surface of the heat conduction substrate, and the pits are in one-to-one correspondence with jet holes in the partition plate; jet pipes are arranged inthe jet holes, and the lower ends of the jet pipes are suspended in the pits, so that the impact sputtering of the jet stream introduced by the jet pipes on the bottom surface of the pits is limited in the pits; in the lower liquid outlet cavity, rib sheets are distributed on the surface of the heat conduction substrate, and the rib sheets are arranged between the two adjacent pits in the workingmedium outflow direction, so that the working medium on the surface of the heat conduction substrate in the lower liquid outlet cavity is blocked from flowing through the downstream pits by virtue ofthe rib sheets. According to the radiator, the jet beam is not affected by the peripheral jet, and the sputtering jet is converted into positive disturbance to the heat conduction substrate, so that the heat exchange effect is enhanced.

Description

technical field [0001] The invention relates to the technical field of heat exchange of power electronic components, in particular to a micro-channel jet radiator. Background technique [0002] With the rapid development of highly integrated electronic devices, micro-electromechanical systems, and high-power lasers, electronic chips are developing in the direction of small size and high power, and the heat dissipation in the unit body is getting higher and higher, resulting in heat generation and temperature. A sharp rise, the heat flux has reached as high as 10 6 -10 7 W / m 2 , so that the temperature of the local hot spot exceeds its safety warning value in a very short period of time, which causes serious mechanical, chemical, electrical and other reliability and safety problems. Studies have shown that 30% of the failure of power electronic devices can be attributed to the thermal failure and thermal stress of the device. The higher the operating temperature of the dev...

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Problems solved by technology

However, on the one hand, since each jet beam ejected through the micro-nozzles of the baffle hits the upper wall of the injection chamber and then sputters away, it will negatively hinder the surrounding jets and weaken the jet impact of the surrounding jets. On the center line of two adjacent impacted surfaces, the fluid flow velocity is almost zero, and the local heat dissipation coefficient is sharply reduced; on the other hand, the liquid rebounded by the sprayed wall falls downward, weakening its own jet The injection force weakens the injection effect, and the fluid flowing out after the injection will flow through the nozzle at the outlet, which further weakens the jet injection force near the outlet of the micro-injector, greatly reducing the injection effect and limiting the heat transfer efficiency. promotion

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