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Etching paste and preparation method thereof

A technology of etching paste and main features, applied in the field of etching paste and its preparation, can solve the problems of many raw materials and the like

Inactive Publication Date: 2019-05-07
厦门蓝科电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these solutions will have more raw materials, among which water-based polymers need water-based polyurethane, polyvinyl alcohol, water-soluble epoxy resin, water-soluble alkyd resin, polyethylene glycol, modified starch, and modified cellulose At least three of resin, modified cellulose ether, water-soluble oil, rosin modified resin and gum arabic

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Etching paste preparation process:

[0033] Raw materials by mass percentage

[0034] Phosphoric acid 20%

[0035] water 3%

[0036] Water-based polyurethane thickener 30%

[0037] Polyether modified silicone leveling agent 0.3%

[0038] Silicone defoamer 0.5%

[0039] Fumed silica 2%

[0040] Glycerol 42.2%

[0041] Carbon black 2%

[0042] Add the selected raw materials into the mixer container with stirring and dispersing cooling water;

[0043] First mix at 60rpm for 3 minutes;

[0044] Turn on the dispersion switch;

[0045] Disperse at 900rpm for 10 minutes;

[0046] Stir for 3 minutes under 120rpm rotating speed again;

[0047] The product is obtained.

[0048] Etching process:

[0049] The etching paste is screen-printed on the glass or PET film coated with ITO film through a 300-mesh screen;

[0050] Put it in an oven and bake at 120°C for 20 minutes.

[0051] Remove the glass or PET film and cool

[0052] Clean the etching paste with water, spr...

Embodiment 2

[0055] Etching paste preparation process:

[0056] Raw materials by mass percentage

[0057] Phosphoric acid 10%

[0058] water 10%

[0059] Associative water-based polyurethane thickener 10%

[0060] Leveling wetting agent 0.3%

[0061] Defoamer 0.5%

[0062] Thixotropic agent 6%

[0063] Glycerol 48.2%

[0064] Carbon black 2%

[0065] Add the selected raw materials into the mixer container with stirring and dispersing cooling water;

[0066] First mix at 60rpm for 3 minutes;

[0067] Turn on the distribution switch;

[0068] Disperse at 800rpm for 10 minutes;

[0069] Stir for 3 minutes under 150rpm rotating speed again;

[0070] The product is obtained.

[0071] Etching process:

[0072] The etching paste is screen-printed on the glass or PET film coated with ITO film through a 300-mesh screen;

[0073] Put it in an oven and bake at 140°C for 30 minutes.

[0074] Remove the glass or PET film and cool

[0075] Clean the etching paste with water, spray or ult...

Embodiment 3

[0078] Etching paste preparation process:

[0079] Raw materials by mass percentage

[0080] Phosphoric acid 1%

[0081] water 3%

[0082] Associative water-based polyurethane thickener 20%

[0083] Leveling wetting agent 0.3%

[0084] Defoamer 0.5%

[0085] Thixotropic agent 9%

[0086] Glycerol 64.2%

[0087] Carbon black 2%

[0088] Add the selected raw materials into the mixer container with stirring and dispersing cooling water;

[0089] First mix at 60rpm for 3 minutes;

[0090] Turn on the distribution switch;

[0091] Disperse at 1000rpm for 10 minutes;

[0092] Stir for 3 minutes under 100rpm rotating speed again;

[0093] The product is obtained.

[0094] Etching process:

[0095] The etching paste is screen-printed on the glass or PET film coated with ITO film through a 300-mesh screen;

[0096] Put it in an oven and bake at 180°C for 20 minutes.

[0097] Remove the glass or PET film and cool

[0098] Clean the etching paste with water, spray or ultras...

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Abstract

The invention provides etching paste. The etching paste is prepared from the following raw materials in percentage by weight: 1-20% of a non-volatile acid, 3-10% of water, 10-40% of a water-based polyurethane thickener, 0.1-1% of a leveling wetting agent, 0.1-2% of a defoaming agent, 2-10% of a thixotropic agent, 30-70% of a water-soluble solvent and 0-5% of pigment. The preparation method of theetching paste comprises the following steps: 1) adding the selected raw materials into a mixer container with stirring and dispersing functions, wherein cooling water is introduced in the mixer container; 2) carrying out mixing at a speed of 60 rpm for 3 minutes; 3) opening a dispersing switch; 4) carrying out dispersing at a rotating speed of 800-1000 rpm for 10 minutes; 5) carrying out dispersing at a rotating speed of 100-150 rpm for 3 minutes; and 6) preparing a product. According to the etching paste provided by the invention, the raw materials are simple, and the etching effect is good.

Description

technical field [0001] The invention relates to an etching paste and a preparation method thereof, in particular to an etching paste which can be used for metal oxide films such as electronics and semiconductors and a preparation method thereof. Background technique [0002] Traditional etching is mainly to use acid and alkali resistant ink or photoresist screen printing to print the part that needs to be protected, expose the part that needs to be etched outside, and then put the product to be etched into acid to corrode and etch, without protection The part is corroded, and the pattern of the protected part is revealed as the acid is washed out together. After the product is etched by acid, it is cleaned in lye to remove ink or photoresist, and the circuit pattern can be obtained after multiple cleanings. [0003] The disadvantage of the traditional etching method is that the process is complicated, such as: [0004] CN201410157734.0 discloses an etching paste compositio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K13/06
Inventor 郑文中翁青松
Owner 厦门蓝科电子科技有限公司
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