Device for filling wafer with glass powder

Abstract

The invention discloses a device for filling a wafer with glass powder. The device belongs to the technical field of electronic component production equipment. The device is characterized by comprising a supporting device for supporting the wafer, a loading device (5) and a scraping device (6), wherein the loading device (5) and the scraping device (6) are arranged on the upper side of the supporting device, the lower side of the loading device (5) is equipped with a material taking portion and drives the material taking portion to move, and a scraper (43) is installed at the lower side of thescraping device (6) and is driven to move. The loading device of the device for filling the wafer with glass powder places the glass powder on the wafer evenly by means of the material taking portion, the scraping mechanism removes the excessive glass powder on the wafer by means of the scraper so as to ensure that the amount of the glass powder on the wafer is moderate, the problem of complicated post processing technology caused by excessive glass powder is avoided, the problem of uneven glass powder division can be avoided, the glass powder painting speed is fast, the painting quality is stable, the qualified rate of electronic components is improved, and the production cost of the product is reduced.

Description

technical field [0001] A device for filling glass powder into a wafer belongs to the technical field of electronic component production equipment. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and becomes an integrated circuit with specific electrical functions. circuit products. In the process of producing electronic components from wafers, glass powder needs to be coated on the wafers to ensure that a protective glass layer can be formed on the sides of the chips after dicing. [0003] At present, the coating of glass powder on the wafer is mostly carried out manually. The glass powder is manually mixed with water, and then the mixed glass powder is painted on the wafer. But the brushing speed of this method is low, thereby affecting the production spee...

AI Technical Summary

Problems solved by technology

But the brushing speed of this method is low, thereby affecting the production speed of the product, the production cost of the product is high, and the quality of the glass powder brushing depends on the labor ability of the worker, and the stability of the brushing is relatively poor, resulting in electronic components The pass rate is low, which further increases the production cost of the product

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