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Angular positioning assembly and process chamber

A technology of angle positioning and process chamber, which is applied in the direction of electrical components, discharge tubes, circuits, etc., can solve the problem of damaging the underlying wafer layer, achieve the effects of reducing production costs, uniform plasma, and improving processing yield

Active Publication Date: 2019-05-03
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the process time is increased, it will appear: the surface of area A, the impurities are removed more thoroughly without residue; the surface of area B, the underlying wafer layer is damaged due to excessive removal

Method used

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  • Angular positioning assembly and process chamber
  • Angular positioning assembly and process chamber
  • Angular positioning assembly and process chamber

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Embodiment Construction

[0060] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0061] like Image 6 , Figure 7 As shown in FIG. 9, the first aspect of the present invention relates to an angle positioning assembly 100, which is suitable for a process chamber 200. For example, the process chamber 200 can be a pre-cleaning process chamber or an etching process chamber, etc. . For ease of description, the process chamber 200 is used as a pre-cleaning process chamber as an example for description below, but the present invention is not limited thereto.

[0062] Wherein, as shown in FIG. 9 , the process chamber 200 includes a chamber body 210 , a ground electrode plate 220 rotatable relative to the chamber body 210 , a ground electrode plat...

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Abstract

The invention discloses an angular positioning assembly and a process chamber. The angle positioning assembly is applicable to the process chamber. The process chamber includes a chamber body, a ground electrode plate rotatable relative to the chamber body, and a base disposed in the chamber body. The base is used for holding a wafer. The angular positioning assembly includes an angular positioning member fixedly connected to the chamber body. The angular positioning member can be configured to define a horizontal rotation angle of the ground electrode plate relative to the chamber body in order that the orthographic projection of the ground electrode plate on the base can completely cover the wafer. The angle positioning assembly can position the horizontal rotation angle of the ground electrode plate, so that the orthographic projection of the ground electrode plate can completely cover the wafer. Thus, an electric field above the wafer can be uniform, and the plasma generated abovethe wafer can be made uniform, thereby improving the processing yield of the wafers and reducing manufacturing cost.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to an angle positioning assembly and a process chamber including the angle positioning assembly. Background technique [0002] Plasma equipment is widely used in today's semiconductor, solar cell, flat panel display and other manufacturing processes. In the current manufacturing process, the types of plasma equipment that have been used include: DC discharge type, capacitively coupled plasma (CCP) type, inductively coupled plasma (ICP) type, and electron cyclotron resonance plasma (ECR) type. These types of discharges are currently widely used in physical vapor deposition (PVD), plasma etching, and plasma chemical vapor deposition (CVD). [0003] In PVD process equipment, especially for IC (Integrated Circuit), TSV (Through Silicon Via) and Packaging (packaging) manufacturing processes, there are generally several processes. For example, if figure 1 As shown, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
Inventor 李萌
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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