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High-density interconnect package structure based on bridge chip

A technology of high-density interconnection and packaging structure, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems such as the inability to meet the needs of high-density interconnection and the increase of interconnection density, and achieve shortening of processing cycle and integration Flexible, cost-reducing effects

Inactive Publication Date: 2019-04-26
58TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-density interconnection packaging structure based on bridge chips to solve the problem that the interconnection density inside the current packaging structure increases sharply and cannot meet the needs of high-density interconnection

Method used

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  • High-density interconnect package structure based on bridge chip

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Embodiment 1

[0024] The invention provides a high-density interconnect packaging structure based on bridge chips, the structure of which is as follows: figure 1 shown. The bridge chip-based high-density interconnect package structure includes a body, and the body has a bridge chip 1 and a through-hole structure 2, and the bridge chip 1 and the through-hole structure 2 are formed by a resin filling material 3. The body, the resin filling material 3 surrounds it, but does not cover the functional areas of the bridge chip 1 and the through-hole structure 2 . Preferably, the body is formed by wafer-level fan-out technology. Specifically, the number and position of the bridge chip 1 and the through-hole structure 2 can be freely adjusted according to actual design needs. In the first embodiment, the number of the bridge chips 1 is two, and the number of the through-hole structures 2 is three. Further, the manufacturing process of the bridge chip 1 is preferably a CMOS process.

[0025] Spec...

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Abstract

The invention discloses a high-density interconnect package structure based on a bridge chip, and belongs to the technical field of integrated circuit packaging. The high-density interconnect packagestructure based on the bridge chip includes a body having the bridge chip and a through hole structure therein, the bridge chip and the through hole structure constitute the body by a resin filling material, and the bridge chip and the functional area of the through hole structure are exposed to the outside; the upper surface of the body is formed with a rewiring layer, and the rewiring layer of the upper surface is interconnected with a functional chip by bumps.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a bridge chip-based high-density interconnect packaging structure. Background technique [0002] Wafer-level fan-out packaging technology, as a solution to realize electronic system miniaturization and low-cost applications, is currently developing into a major advanced packaging process with high integration flexibility. This technology does not require a substrate, and wafer-level packaging can achieve micron-scale manufacturing accuracy, which meets the urgent needs of modern electronic systems for miniaturization, low cost, and high integration. As a key technology of wafer-level fan-out packaging, rewiring technology realizes the signal interconnection between functional chips and the transfer of signal input and output terminals (I / O). [0003] With the further improvement of the demand for miniaturization of electronic systems, more and more products ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/535H01L23/538
CPCH01L23/535H01L23/5384H01L2924/15192H01L2224/16227H01L2924/15311
Inventor 王波明雪飞高娜燕
Owner 58TH RES INST OF CETC
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