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A kind of preparation method of high-purity titanium-nickel-copper shape memory alloy casting ingot

A memory alloy and titanium-nickel-copper technology, which is applied in the field of preparing high-purity titanium-nickel-copper shape memory alloy ingots, can solve the problem that the content of O element in the ingot cannot be reduced, the metallurgical defects cannot be better eliminated, and the coarse grain structure cannot be eliminated. Solve problems such as limited handling, and achieve the effect of good stability of O element content, reduction of metallurgical defects, and fine grain structure

Active Publication Date: 2020-01-10
西安斯塔克材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The embodiment of the present application provides a method for preparing a high-purity titanium-nickel-copper shape memory alloy ingot, which solves the problem in the prior art that the content of O in the ingot cannot be reduced, and the treatment of the coarse grain structure obtained after smelting is limited. , can not better eliminate the technical problems of metallurgical defects formed by smelting, and achieve the technology of simple ingot preparation, controllable and low content of impurity element O, good stability of O element content, fine grain structure and greatly reduced metallurgical defects Effect

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  • A kind of preparation method of high-purity titanium-nickel-copper shape memory alloy casting ingot
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Embodiment

[0023] This embodiment provides a preparation method of high-purity titanium-nickel-copper shape memory alloy ingot, please refer to figure 1 , the preparation method of the high-purity titanium-nickel-copper shape memory alloy ingot comprises:

[0024] Step 1: Screening, cleaning and drying the raw materials in sequence, wherein the raw materials include titanium sponge particles, electrolytic nickel particles, high-purity copper particles and phosphor copper master alloy.

[0025] Further, in the step 1, it also includes: in the raw material screening process, the titanium sponge particles meet the first particle size range, the electrolytic nickel particles and high-purity copper particles meet the second particle size range, the phosphor copper The master alloy satisfies the third grain size range.

[0026] Further, the range of the first particle size is 3-12.7mm.

[0027] Further, the second particle size range is less than or equal to 10×10mm.

[0028] Further, the t...

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Abstract

The invention discloses a preparation method for high-purity titanium nickel copper shape memory alloy ingots, and relates to the technical field of shape memory alloy preparation. Raw materials are screened, cleaned and dried; the raw materials comprise sponge titanium particles, electrolytic nickel particles, high-purity copper particles and phosphorus copper intermediate alloys; after the driedraw materials are weighed, the materials are paved in a smelting furnace in sequence according to a first preset condition; the materials are smelted according to a vacuum induction smelting technology, wherein the smelting process comprises power supply, degassing, refining and casting; the aftertreatment is performed on ingots after casting according to a second preset condition by adopting a hot isostatic pressing method; and then, the flaw detection, the riser cutting and the bottom cushioning are performed on the ingots after aftertreatment in sequence to obtain high-purity titanium nickel copper ingots. The preparation method achieves the technical effects of convenience to prepare the ingots, controllable and lower content of impurity element O, high content stability of the O element, fine grain structure and great reduction of metallurgy defects.

Description

technical field [0001] The invention belongs to the technical field of shape memory alloy preparation, in particular to a method for preparing high-purity titanium-nickel-copper shape memory alloy ingot. Background technique [0002] Titanium-nickel-copper shape memory alloy is a shape memory alloy obtained by substituting part of Cu atoms for Ni atoms on the basis of titanium-nickel shape memory alloy. Due to its small loading platform stress and long-lasting and stable recovery force, it has been widely used in aerospace and biomedical fields in recent years. [0003] However, due to the sensitivity of its compositional fluctuations (Ni atoms and the content of Cu atoms replacing Ni atoms), especially the stability of the content of impurity elements (O, C, N elements) in the same batch of materials has a greater impact on its performance. Therefore, in the process of production and processing, controlling the content of main elements and impurity elements has become a ke...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/03
CPCC22C1/03
Inventor 林劭华李雷王卫民符欣杜广来林新洋尹振廷
Owner 西安斯塔克材料科技有限公司
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