Preparation method of super-heat-resistant and high-heat-conductivity epoxy plastic encapsulating material for encapsulating semiconductor

An epoxy plastic sealing compound, super heat-resistant technology, applied in the high thermal conductivity epoxy plastic sealing material, super heat-resistant field, can solve the problem that the epoxy plastic sealing material has too many solid fillers, can not effectively solve the raw material dispersion uniformity, poor mixing ability and other problems, to achieve the effect of increasing the glass transition temperature, improving thermal conductivity, and increasing heat resistance

Active Publication Date: 2019-03-26
江苏中科科化新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Epoxy molding compound has more solid fillers, and the mixing ability is generally poor
The process used in the past cannot effectively solve the dispersion uniformity of raw materials, so the above problems need to be solved urgently

Method used

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  • Preparation method of super-heat-resistant and high-heat-conductivity epoxy plastic encapsulating material for encapsulating semiconductor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] See Table 1 for the composition of the raw material formulation of the super heat-resistant, high thermal conductivity epoxy molding compound for semiconductor packaging in Example 1.

[0071] In this embodiment, the method for preparing super heat-resistant and high thermal conductivity epoxy molding compound for semiconductor packaging is as follows:

[0072] (1) 112.5g phenolic resin PF8010, 5.63g accelerator 2-ethyl-4 methylimidazole, 4.95g low stress modifier SF-8241EG, 6.75g coupling agent KH560 and 5.63g release agent carnauba wax Add it into the mixer and stir it at 150°C for 40 minutes. When the mixture in the container is melted and mixed well, it is cooled, pulverized and sieved for use.

[0073] (2) 45.15g of the mixture obtained in step (1), 45g of epoxy resin TTA 3150, 210g of silica powder, 435g of spherical alumina, 10.35g of ion trapping agent DHT-4C, 2.25g of flame retardant zinc borate and 2.25 g coloring agent carbon black was put into a high-speed ...

Embodiment 2

[0076] See Table 1 for the raw material formulation composition of the super heat-resistant, high thermal conductivity epoxy molding compound for semiconductor packaging in Example 2.

[0077] In this embodiment, the method for preparing super heat-resistant and high thermal conductivity epoxy molding compound for semiconductor packaging is as follows:

[0078] (1) Add 150g phenolic resin PF5090, 9g accelerator 2-ethyl-4 methylimidazole, 3.9g low stress modifier SF-8241EG, 6g coupling agent KH560 and 9g release agent carnauba wax to the mixer Stir at 170°C for 60 minutes, and when the mixture in the container is melted and mixed well, cool, pulverize and sieve for use.

[0079] (2) 44.48g of the mixture obtained in step (1), 67.5g of epoxy resin HP 4700, 99.53g of silica micropowder, 525g of spherical alumina, 7.5g of ion trapping agent DHT-4C, 3.75g of flame retardant zinc borate and 2.25g of colorant carbon black were put into a high-speed mixer and mixed for 8 minutes, and...

Embodiment 3

[0082] See Table 1 for the composition of the raw material formulation of the super heat-resistant, high thermal conductivity epoxy molding compound for semiconductor packaging in Example 3.

[0083] In this embodiment, the method for preparing super heat-resistant and high thermal conductivity epoxy molding compound for semiconductor packaging is as follows:

[0084] (1) Add 210g phenolic resin PF5090, 3g accelerator 2-ethyl-4 methylimidazole, 7.5g low stress modifier SF-8241EG, 6g coupling agent KH560 and 3g release agent carnauba wax to the mixer Inside, stir at 170°C for 50 minutes, and when the mixture in the container is melted and fully mixed, cool, pulverize and sieve for use.

[0085] (2) 57.37g of the mixture obtained in step (1), 90g of epoxy resin HP 7241, 180g of silica powder, 405g of spherical alumina, 7.5g of silicon nitride, 3.75g of ion trapping agent DHT-4C, 5.25g of resist The fuel zinc borate and 1.5g of the colorant carbon black were put into a high-spee...

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Abstract

The invention provides a preparation method of a super-heat-resistant and high-heat-conductivity epoxy plastic encapsulating material for encapsulating a semiconductor. The plastic encapsulating material contains the following raw material components in parts by weight: 45-127.5 parts of epoxy resin, 60-300 parts of a curing agent, 3.75-10.35 parts of an ion capturing agent, 3.9-15 parts of a low-stress modifying agent, 3-6.75 parts of a coupling agent, 0.9-9 parts of an accelerant, 525-672.25 parts of a solid filler, 3-12 parts of a demolding agent, 2.25-5.25 parts of a flame retardant and 1.5-2.25 parts of a coloring agent. According to the method, an epoxy plastic encapsulating material mixture is subjected to pretreatment and high-speed dispersion and is added into an open mill to be mixed, and a premixing manner is changed, so that the mixing uniformity of the raw materials can be effectively improved, and particularly the uniformity of the added components with relatively small contents is improved. The main differences between the mixing method and the existing technical scheme are that the use operability of a product at a client is well improved, besides, the mixing of thecomponents is promoted, the stability of the product is relatively good, and the prepared epoxy plastic encapsulating material has an extremely high glass transition temperature and a relatively highheat conductivity coefficient.

Description

technical field [0001] The invention relates to a super-heat-resistant and high-thermal-conduction epoxy molding compound for semiconductor packaging, which belongs to the field of electronic packaging. Background technique [0002] Epoxy resin as the main resin and curing agent is cured at high temperature under the action of a curing accelerator. The combination of epoxy resin and phenolic resin is the mainstream of electronic molding compounds today. Among the above materials, silica, calcium carbonate, etc. Inorganic fillers, as well as flame retardants and various additives, can prepare plastic packaging materials that meet the needs of electronic packaging. Epoxy molding compounds have many beneficial properties and are widely used in the field of electronic packaging. [0003] With the development of chip frontier fields such as silicon carbide, silicon nitride, boron nitride, and gallium nitride chips, their operating temperature is higher than 175°C. On the one han...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/06C08L91/06C08K13/02C08K3/36C08K3/22C08K3/38C08K3/34C09K5/14
CPCC08K2003/2227C08K2003/385C08K2003/387C08L63/00C08L2201/02C08L2201/08C08L2203/206C08L2205/025C08L2205/035C09K5/14C08L61/06C08L91/06C08K13/02C08K3/36C08K3/22C08K3/38C08K3/34
Inventor 杨鑫浩李海亮李刚王善学卢绪奎
Owner 江苏中科科化新材料股份有限公司
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