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Method for manufacturing difficult-to-deform tin-bismuth alloy pre-formed soldering lug

A technology of solder preforms and tin-bismuth alloys, which is applied in metal rolling and other directions, can solve the problems of easy cracking of finished products, high processing difficulty, and difficulty in forming brittle tin-bismuth alloys, etc., so as to reduce operation steps, reduce operation difficulty, and low cost. Effect of rolling temperature

Active Publication Date: 2019-03-26
SHENZHEN XINGHONGTAI TIN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a method for preparing a hard-to-deform tin-bismuth alloy solder preform, aiming to solve the problems that the current brittle tin-bismuth alloy is difficult to form, difficult to process, and the finished product is easy to crack

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A kind of preparation technology of rectangular annular Sn-58Bi eutectic solder preform is as follows:

[0028] Mix 21g of tin ingot and 29g of bismuth ingot according to the required mass percentage of 42:58, put it into an alumina crucible with an appropriate amount (5-10g) of rosin-based metal melting protectant, and heat it to 300 °C, after the metal ingot is completely melted, keep it at 150 °C for 30 minutes, and then pour the molten metal into a rectangular mold.

[0029] The temperature-increasing and speed-reducing speed-changing rolling of the obtained plate: the ingot is subjected to low-temperature, high-speed, large-reduction rough rolling and high-temperature, low-speed, small-reduction finishing rolling with a two-roller synchronous hot calender with a roll diameter of 122mm; Rough rolling: For a Sn-58Bi alloy sheet with a thickness of 5mm, set the rolling temperature to 78°C, the rolling speed to 2.8m / min, and the reduction between each pass during the r...

Embodiment 2

[0033] The preparation technology of a kind of rolled shape Sn-52Bi hypoeutectic solder preform is as follows:

[0034] Mix 24g of tin ingot and 26g of bismuth ingot according to the required mass percentage of 48:52, put it into an alumina crucible with an appropriate amount (5-10g) of rosin-based metal melting protectant, and heat it to 320°C in a well-type resistance furnace. ℃, after the metal ingot is completely melted, it is kept at 175 ℃ for 35 minutes, and then the molten metal is poured into a rectangular mold.

[0035] The temperature-increasing and speed-reducing speed-changing rolling of the obtained plate: the ingot is subjected to low-temperature, high-speed, large-reduction rough rolling and high-temperature, low-speed, small-reduction finishing rolling with a two-roller synchronous hot calender with a roll diameter of 122mm; Rough rolling: For a Sn-52Bi alloy sheet with a thickness of 4.5mm, set the rolling temperature to 80°C, the rolling speed to 3.5m / min, an...

Embodiment 3

[0039] A kind of preparation technology of rectangular Sn-62Bi hypereutectic solder preform is as follows:

[0040] Mix 19g of tin ingot and 31g of bismuth ingot according to the required mass percentage of 38:62, put it into an alumina crucible with an appropriate amount (5-10g) of rosin-based metal melting protectant, and heat it to 310 ℃, after the metal ingot is completely melted, it is kept at 173 ℃ for 40 minutes, and then the molten metal is poured into a rectangular mold.

[0041] The temperature-increasing and speed-reducing speed-changing rolling of the obtained plate: the ingot is subjected to low-temperature, high-speed, large-reduction rough rolling and high-temperature, low-speed, small-reduction finishing rolling with a two-roller synchronous hot calender with a roll diameter of 122mm; Rough rolling: For a Sn-62Bi alloy sheet with a thickness of 5mm, set the rolling temperature to 77°C, the rolling speed to 2.3m / min, and the reduction between each pass during th...

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Abstract

The invention discloses a method for manufacturing a difficult-to-deform tin-bismuth alloy pre-formed soldering lug. The method is characterized in that a core process adopts a two-section type temperature-regulating variable-speed and turning calendaring process, namely low-temperature high-speed large-rolling-reduction rough rolling and high-temperature low-speed small-rolling-reduction fine rolling; a temperature, speed and a rolling direction in a calendaring process are controlled, and other processes comprising low-temperature smelting, residual stress relief hot-levelling, rolling, cutting and the like are combined, so that high-efficiency manufacturing for the difficult-to-deform tin-bismuth alloy pre-formed soldering lug is realized. The manufacturing process for the pre-formed soldering lug can effectively solve the problems that a tin-bismuth alloy with intrinsic brittleness and difficult-to-deform characteristic easily generates material crack and the like in a large-deformation-amount processing process, and total deformation amount of the alloy can be 98% or more. The process is simple in flow, can greatly improve production efficiency of a tin-bismuth pre-formed lug,and reduces production energy consumption.

Description

technical field [0001] The invention relates to an electronic packaging connection material, in particular to a method for preparing a hard-to-deform tin-bismuth alloy preformed solder sheet. Background technique [0002] In recent years, with the rapid development of the electronic industry, the innovation speed of electronic component manufacturing technology and microelectronic integration technology has accelerated. Therefore, the industry's requirements for solder, which plays an important role in the electronic packaging process, are also increasing. At present, the main lead-free solder products on the market include tin wire, tin bar, solder paste, solder ball and other types. Tin wire is mainly suitable for manual welding and machine automatic welding, because of its relatively low efficiency in industrial production. With the further advancement of China's Manufacturing 2025 and Industry 4.0 plans, the future use of tin wire is bound to be further restricted. Tin ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21B3/00B21B1/26B21D1/00C22C1/02C22C12/00C22C1/06
CPCB21B1/26B21B3/00B21D1/00C22C1/02C22C1/06C22C12/00
Inventor 邢璧凡邢鸿伟徐腾飞张新平周舟马骁周敏波
Owner SHENZHEN XINGHONGTAI TIN
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