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Chemical copper plating activating agent, preparation method thereof as well as activating agent based method of preparing circuit by adopting fully additive method

An electroless copper plating and activator technology, which is applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of complex and time-consuming preparation, the influence of conductive ink, and poor universality of the bridging layer on the substrate surface. To achieve the effect of ensuring uniform distribution

Active Publication Date: 2019-03-19
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Aiming at the problems that the existing full-addition circuit manufacturing process faces such problems as conductive ink is easy to agglomerate and additives affect the circuit conductivity, and the bridging layer on the surface of the substrate is poor in universality and complicated and time-consuming to prepare, the present invention provides a new electroless copper plating activator and Preparation method and method for making full addition circuit based on the activator

Method used

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  • Chemical copper plating activating agent, preparation method thereof as well as activating agent based method of preparing circuit by adopting fully additive method
  • Chemical copper plating activating agent, preparation method thereof as well as activating agent based method of preparing circuit by adopting fully additive method
  • Chemical copper plating activating agent, preparation method thereof as well as activating agent based method of preparing circuit by adopting fully additive method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Select thiourea as a complexing agent, dissolve it in propylene glycol methyl ether under the condition of room temperature and magnetic stirring 200r / min, and obtain a solution with a thiourea concentration of 0.03mol / L; add catalyst AgNO 3 , completely dissolved under magnetic stirring to obtain a solution with a silver ion concentration of 0.01mol / L; then add 1.5mol / L bisphenol A epoxy resin and completely dissolve under magnetic stirring; then add an appropriate amount of curing agent 593 and magnetically stir evenly, Until the viscosity is 50-80mPa·S, the surface tension is between 25-45mN / m; use inkjet printing equipment to print the activator on the surface of the epoxy glass fiber substrate to form a preset circuit diagram with catalytic activity; room temperature curing Cooperate with electroless copper plating to obtain the required conductive pattern.

[0067] figure 2 a is the EDS energy spectrum analysis diagram of the copper layer after electroless coppe...

Embodiment 2

[0070] The operation of this embodiment is basically the same as that of Example 1, except that the composition of the electroless copper plating activator is specifically: the organic solvent is propylene glycol methyl ether acetate, and the concentration of 3-mercaptopropyltriethoxysilane is 0.1mol / L, AgNO 3 The concentration of the novolak epoxy resin is 0.015mol / L, the concentration of the novolak epoxy resin is 2mol / L, add an appropriate amount of curing agent 593 and magnetically stir evenly until the viscosity is 50-80mPa·S and the surface tension is between 25-45mN / m.

[0071] Cyclopenta-2,4-dienyl-1-thione (C 5 h 4 S) and 1-pyrrole-1-thiol (C 4 h 5 NS)

Embodiment 3

[0073] The operation of this embodiment is basically the same as that of Example 1, except that the composition of the electroless copper plating activator is specifically: the organic solvent is dipropylene glycol methyl ether, and the concentration of 3-aminopropyltriethoxysilane is 0.5mol / L, AgNO 3 The concentration of the epoxy resin is 0.02mol / L, and the concentration of the glycerol ether epoxy resin is 3mol / L. Add an appropriate amount of curing agent 593 and magnetically stir evenly until the viscosity is 50-80mPa·S and the surface tension is between 25-45mN / m.

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Abstract

The invention relates to a chemical copper plating activating agent, a preparation method thereof as well as an activating agent based method of preparing a circuit by adopting an fully additive method, and belongs to the technical field of chemical plating and circuit manufacturing. According to the activating agent, the preparation method and the method of preparing the circuit, a complexing agent which is mutually soluble with an adhesive and contains an unsaturated bond and a curing agent matched with the adhesive are added on the basis of a traditional activator, in the curing process after a preset circuit pattern is formed, the adhesive is firmly combined with a base material through physical adsorption and chemical action, meanwhile, the complexing agent for adsorbing catalyst ionsis chemically bonded with an epoxy resin adhesive, so that the catalyst ions are enabled to be uniformly distributed in an activation layer of the surface of the base material, so that a bridging layer and a fixed catalyst are formed on the surface of the base material in one step, and a plating layer which is dense, bright and strong in adhesive force can be formed by cooperating with a subsequent chemical plating process. The problems that metal nanoparticle agglomeration and an additive influence circuit conductivity, the bridging layer of the surface of a substrate board is poor in universality, preparation is complex and time consumption is large in the case of an existing fully-additive circuit manufacturing process are solved.

Description

technical field [0001] The invention belongs to the technical field of electroless plating and circuit production, and in particular relates to an electroless copper plating activator, a preparation method thereof, and a method for fully additively producing circuit based on the activator. Background technique [0002] At present, the mainstream printed circuit board circuit manufacturing methods are as follows: subtractive method, semi-additive method and full additive method: [0003] The subtractive method is a method of making circuits on a substrate with a copper layer of a specified thickness (the thickness is the final required thickness of the copper layer circuit) formed on the surface. First, a film is pasted on the copper layer and developed to form a resist pattern, and then through selective engraving. The exposed copper layer is removed by etching, and finally the circuit pattern is obtained after removing the resist pattern. The process flow of the method is ...

Claims

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Application Information

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IPC IPC(8): C23C18/40
CPCC23C18/40
Inventor 王跃峰洪延周国云何为王守绪王翀陈苑明杨文君
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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