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Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve problems such as cracking and peeling

Pending Publication Date: 2019-02-26
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The composition is improved in terms of chemical resistance to photoresist strippers, etc., but still has a cured coating that can withstand thermal cycling tests (10 minutes at -25°C and 10 minutes at 125°C). Delamination or cracking from the substrate in the test repeated 1,000 cycles)

Method used

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  • Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process
  • Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process
  • Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0335] Synthetic resin 1

[0336] A 3 L flask equipped with a stirrer, thermometer, nitrogen purge line and reflux condenser was charged with 135.5 g (0.25 mol) of compound (S-1), 28.5 g (0.05 mol) of compound (S-3) and 86.0 g ( 0.2 mol) compound (S-7), additionally charge 2,000 g of toluene, and heat at 70°C. After that, 1.0 g of a toluene solution of chloroplatinic acid (platinum concentration: 0.5 wt %) was added, and 58.2 g (0.30 mol) of compound (S-5) and 604.0 g (0.20 mol) of y 1 Compound (S-6) = 40 (Shin-Etsu Chemical Co., Ltd.). The molar ratio of the total amount of hydrosilyl groups to the total amount of alkenyl groups is 1 / 1. At the end of the dropwise addition, the reaction solution was heated and aged at 100° C. for 6 hours. Toluene was distilled off from the reaction solution in vacuo to yield resin 1. pass 1 H-NMR and 29 Si-NMR spectroscopy (Bruker Corp.), Resin 1 was identified as containing repeating units having formulas (a1) to (a4) and (b1) to (b4). ...

Embodiment 2

[0338] Synthetic resin 2

[0339] A 3 L flask equipped with a stirrer, thermometer, nitrogen purge line and reflux condenser was charged with 26.5 g (0.10 mol) of compound (S-2), 57.0 g (0.10 mol) of compound (S-3), 18.6 g ( 0.10 mol) of compound (S-4) and 86.0 g (0.20 mol) of compound (S-7), additionally charged with 2,000 g of toluene, and heated at 70°C. After that, 1.0 g of a toluene solution of chloroplatinic acid (platinum concentration: 0.5 wt %) was added, and 58.2 g (0.30 mol) of compound (S-5) and 317 g (0.20 mol) of y 1 Compound (S-6) = 40 (Shin-Etsu Chemical Co., Ltd.). The molar ratio of the total amount of hydrosilyl groups to the total amount of alkenyl groups is 1 / 1. At the end of the dropwise addition, the reaction solution was heated and aged at 100° C. for 6 hours. Toluene was distilled off from the reaction solution in vacuo to yield resin 2. pass 1 H-NMR and 29 Si-NMR spectroscopy (Bruker Corp.), Resin 2 was identified as containing repeating units h...

Embodiment 3

[0341] Synthetic resin 3

[0342] A 3 L flask equipped with a stirrer, thermometer, nitrogen purge line and reflux condenser was charged with 66.3 g (0.25 mol) of compound (S-2), 9.3 g (0.05 mol) of compound (S-4) and 86.0 g ( 0.20 mol) compound (S-7), additionally charge 2,000 g of toluene, and heat at 70°C. After that, 1.0 g of a toluene solution of chloroplatinic acid (platinum concentration: 0.5 wt %) was added, and 58.2 g (0.30 mol) of compound (S-5) and 604.0 g (0.20 mol) of y 1 Compound (S-6) = 40 (Shin-Etsu Chemical Co., Ltd.). The molar ratio of the total amount of hydrosilyl groups to the total amount of alkenyl groups is 1 / 1. At the end of the dropwise addition, the reaction solution was heated and aged at 100° C. for 6 hours. Toluene was distilled off from the reaction solution in vacuo to yield resin 3. pass 1 H-NMR and 29 Si-NMR spectroscopy (Bruker Corp.), Resin 3 was identified as containing repeating units having formulas (a1) to (a5) and (b1) to (b5). ...

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Abstract

The invention relates to a photosensitive resin composition, a photosensitive resin coating, a photosensitive dry film, a laminate, and a pattern forming process. The photosensitive resin compositioncomprising (A) a silicone resin comprising recurring units having formula (al) and recurring units having formula (bl), (B) a filler, and (C) a photoacid generator is coated onto a substrate to form aphotosensitive resin coating which can be processed into a fine pattern in thick film form, has improved film properties like crack resistance, and is reliable as protective film.

Description

[0001] Cross References to Related Applications [0002] This nonprovisional application claims priority under 35 U.S.C. Section 119(a) to Patent Application No. 2017-153901 filed in Japan on August 9, 2017, the entire contents of which are incorporated by reference into this article. technical field [0003] The present invention relates to a photosensitive resin composition, a photosensitive resin coating, a photosensitive dry film, a pattern forming method using the composition or dry film, and a laminate using the coating. Background technique [0004] In the prior art, photosensitive protective films for semiconductor devices and photosensitive insulating films for multilayer printed circuit boards are composed of photosensitive polyimide compositions, photosensitive epoxy resin compositions, photosensitive silicone Compositions etc. are formed. As a photosensitive material for protecting such substrates and circuits, Patent Document 1 discloses a photosensitive sili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/16
CPCG03F7/004G03F7/16G03F7/038G03F7/0757G03F7/0042G03F7/20G03F7/26C08G77/52G03F7/0045G03F7/11G03F7/168G03F7/2004G03F7/325G03F7/38G03F7/40H01L21/0274H01L23/296H01L24/32H01L2224/29191H01L2224/32145
Inventor 丸山仁近藤和纪
Owner SHIN ETSU CHEM IND CO LTD
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