Integrated control device suitable for thermal centrifugal comprehensive test

A comprehensive test and control device technology, applied in the field of simulation test, can solve problems such as product stress increase, failure, structural stiffness decrease, etc., and achieve the effects of direct temperature zone control, accurate temperature control, and high thermal efficiency

Pending Publication Date: 2019-02-22
GENERAL ENG RES INST CHINA ACAD OF ENG PHYSICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If special measures are not taken, it will seriously affect the refrigeration of the compressor, and the internal heat dissipation of the product will be difficult;
[0005] 2) The centrifugal environment increases the inertial force, which will increase the internal stress of the product
The severe centrifugal field environment will bring large displacement, which may cause changes in the working state of the product. For example, if the relative displacement between the contacts of the relay is large, the on-off state will be changed, resulting in malfunction and malfunction; Make the electrical and mechanical properties of other products out of tolerance;
[0006] 3) The normal working environment temperature of the instruments and equipment in the missile (arrow) instrument cabin should generally not exceed 50°C. When the outer surface of the cabin is aerodynamically heated, the temperature of the bulkhead will rise sharply, which will cause the temperature in the cabin to exceed the limit and cause damage to the element. The performance of the device deteriorates or even fails, resulting in dangerous consequences
[0007] 4) Under the joint action of high temperature, thermal stress and mechanical stress, the structure will undergo large deformation, destroying its aerodynamic shape, and the high temperature will reduce the structural stiffness and affect its vibration transmission characteristics. Reduce the natural frequency of the structure, and in severe cases, flutter will occur, and even more dangerous resonance phenomena will occur, and the so-called aerothermoelasticity problem
However, the power supply power of the domestic centrifuge is far from meeting the normal demand of the temperature box at the time of design;
[0018] 3) When the temperature box is working normally, it needs to be placed on the ground stably. When working under the action of centrifugal force, all components may not work normally in the centrifugal environment;
[0019] 4) Using the centrifuge + temperature box mode, the temperature control is usually the ambient temperature, and the product response temperature cannot be paid attention to. During the flight, the real situation of the product is different regions, and the temperature response may vary greatly. Therefore, the temperature box cannot be accurate. A simulation that controls the temperature of this response;

Method used

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  • Integrated control device suitable for thermal centrifugal comprehensive test
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Embodiment Construction

[0032] The present invention will be further described below in conjunction with accompanying drawing:

[0033] Such as figure 1 As shown, this embodiment is an integrated control device suitable for thermal centrifugation comprehensive test, including a centrifuge, a temperature control system, and a thermal centrifuge comprehensive monitoring system; the centrifuge is provided with a collector ring; the temperature control system includes A temperature sensor, a temperature controller and a heating module; the heating module is arranged at the arm end of the centrifuge, and a heat preservation cover is arranged outside the heating module; the temperature sensor and the heating module are all connected to the temperature controller; the temperature controller It is connected with the centrifuge through the collector ring and the thermal centrifuge comprehensive monitoring system.

[0034] The heating module is a flexible heating belt, and the flexible heating belt is wound o...

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Abstract

The invention discloses an integrated control device suitable for a thermal centrifugal comprehensive test. The integrated control device comprises a centrifugal machine, a temperature control systemand a thermal centrifugal comprehensive monitoring system, wherein the centrifugal machine is provided with collector rings; the temperature control system comprises a temperature sensor, a temperature controller and a heating module; the heating module is arranged at the arm end of the centrifugal machine, and a temperature holding hood is arranged on the outer side of the heating module; the temperature sensor and the heating module are connected with the temperature controller; and the temperature controller and the centrifugal machine are connected with the thermal centrifugal comprehensive monitoring system through the collector rings. In thermal-centrifugal test equipment, the integrated control device realizes multiple temperature zone control based on product temperature response in a centrifugal field environment, and realizes more accurate temperature control. Due to the cooperative work of the temperature control system and a centrifugal control system, data interaction is realized, and test load is loaded.

Description

technical field [0001] The invention relates to the technical field of simulation tests, in particular to an integrated control device suitable for thermal centrifugation comprehensive tests. Background technique [0002] Aircraft such as missiles, spaceships, space shuttles, and their warheads are subjected to the combined effects of various environmental factors such as centrifugal force and temperature during launch and reentry. On the one hand, the centrifugal environment will cause the flying mass to generate inertial force, which will cause the aircraft, spacecraft and carried products to appear overweight. On the other hand, under different temperature environments, the physical performance parameters of different materials, such as elastic modulus, Poisson's ratio, thermal conductivity coefficient, specific heat capacity coefficient, and thermal expansion parameters will also change accordingly, which will lead to changes in the internal stress and dynamic characteri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B64G7/00
CPCB64G7/00
Inventor 李翀鲁亮欧峰
Owner GENERAL ENG RES INST CHINA ACAD OF ENG PHYSICS
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