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A kind of preparation method of copper alloy bonding wire

A technology of bonding wires and copper alloy wires, which is applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of expensive bonding wires, poor bonding performance, and easy oxidation of the surface, so as to improve oxidation resistance and corrosion resistance ability, ensuring surface gloss, and improving bonding strength

Active Publication Date: 2019-08-23
河南大仑电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems of the existing bonding wires that are expensive, easy to oxidize the surface, poor bonding performance, and prone to wire breakage, and propose a copper alloy bonding wire and its preparation method

Method used

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  • A kind of preparation method of copper alloy bonding wire
  • A kind of preparation method of copper alloy bonding wire

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Effect test

Embodiment 1

[0028] A copper alloy bonding wire proposed by the present invention, the copper alloy bonding wire uses a copper-based alloy as a substrate, the surface of the substrate is coated with a palladium layer, the thickness of the palladium layer is 0.3 μm, and the purity of palladium in the palladium layer is greater than 99.9999%, the copper-based alloy includes the following raw materials in parts by weight: 82 parts of copper, 2 parts of silver, 0.4 part of magnesium, 0.2 part of gold, and 1 part of cerium;

[0029] The preparation method of copper alloy bonding wire: comprises the following steps:

[0030] S1. Pretreatment of raw materials: select copper ingots and silver ingots, wash them with a 5% sodium hydroxide aqueous solution, then wash them with deionized water, and dry them to complete the pretreatment of copper ingots and silver ingots;

[0031] S2, preparation of alloy billet: prepare raw materials according to the weight of 82 parts of copper, 2 parts of silver, 0....

Embodiment 2

[0044] A copper alloy bonding wire proposed by the present invention, the copper alloy bonding wire uses a copper-based alloy as a substrate, the surface of the substrate is coated with a palladium layer, the thickness of the palladium layer is 0.4 μm, and the purity of palladium in the palladium layer is greater than 99.9999%, the copper-based alloy includes the following raw materials in parts by weight: 85 parts of copper, 3 parts of silver, 0.6 part of magnesium, 0.3 part of gold, and 2 parts of cerium;

[0045] The preparation method of copper alloy bonding wire: comprises the following steps:

[0046] S1, pretreatment of raw materials: select copper ingots and silver ingots, wash them with a 7% sodium hydroxide aqueous solution, then wash them with deionized water, and dry them to complete the pretreatment of copper ingots and silver ingots;

[0047] S2. Preparation of alloy billet: prepare raw materials according to the weight of 85 parts of copper, 3 parts of silver, 0...

Embodiment 3

[0060] A copper alloy bonding wire proposed by the present invention, the copper alloy bonding wire uses a copper-based alloy as a substrate, the surface of the substrate is coated with a palladium layer, the thickness of the palladium layer is 0.6 μm, and the purity of palladium in the palladium layer is greater than 99.9999%, the copper-based alloy includes the following raw materials in parts by weight: 88 parts of copper, 4 parts of silver, 0.8 parts of magnesium, 0.5 parts of gold, and 3 parts of cerium;

[0061] The preparation method of copper alloy bonding wire: comprises the following steps:

[0062] S1. Pretreatment of raw materials: select copper ingots and silver ingots, wash them with an aqueous solution of sodium hydroxide with a mass concentration of 8%, then wash them with deionized water, and dry them to complete the pretreatment of copper ingots and silver ingots;

[0063] S2, the preparation of alloy billet: prepare raw material according to weight 88 parts ...

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Abstract

The invention provides a copper alloy bonding lead wire and a preparation method thereof. The copper alloy bonding lead wire takes a copper-based alloy as a matrix and the surface of the matrix is plated with a palladium layer; the copper-based alloy is prepared from the following raw materials: copper, silver, magnesium, gold and cerium; the preparation method of the copper alloy bonding lead wire comprises the following steps: S1, pre-treating raw materials; S2, preparing an alloy blank; S3, preparing an alloy rod; S4, carrying out primary drawing; S5, carrying out medium drawing; S6, carrying out final drawing; S7, carrying out surface washing: washing with an acid washing solution for the first time, washing with de-ionized water for the second time, washing with the acid washing solution for the third time and washing with an ethanol-water mixed solution with an ethanol-water mixed solution; S8, plating the surface with palladium; S9, carrying out fine drawing; S10, carrying out heat treatment; S11, rewinding and sub-packaging. The copper alloy bonding lead wire provided by the invention has the advantages of low production cost, good surface washing effect, small corrosiveness on a copper alloy and easiness of causing wire breaking.

Description

technical field [0001] The invention relates to the technical field of metal bonding wires, in particular to a copper alloy bonding wire and a preparation method thereof. Background technique [0002] Wire bonding is a method of using thin metal wires, using heat, pressure, and ultrasonic energy to tightly weld the metal wires and substrate pads to achieve electrical interconnection between chips and substrates and information exchange between chips. It is commonly used in the field of microelectronics. packaging material. Early bonding wires were mostly made of pure gold, or were pure silver gold-plated bonding wires. However, with the increasing scarcity of gold resources, the price of gold continues to rise, and the production cost of pure gold bonding wires is relatively high. In contrast, the cost of pure silver gold-plated bonding wires is relatively low. In the lead integrated circuit packaging technology, problems such as oxidation, hard material, sliding ball at t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/02C22C9/00C22F1/08C23G1/10C25D3/50C25D7/06H01L33/62
Inventor 贺龙彪时高伟申振武
Owner 河南大仑电子科技有限公司
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