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Method for preparing copper-graphene compound plating layer, chemical plating solution and plating solution preparation method

A technology of graphene composite and chemical plating solution, which is applied in the field of chemical plating, can solve the problems of easy agglomeration of Gr or GO, direct decomposition of the plating solution, and reduced stability of the plating solution, and achieves the advantages of easy operation, low cost and improved performance Effect

Inactive Publication Date: 2019-01-22
SHENZHEN RES INST OF WUHAN UNIVERISTY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main difficulties are: 1) For electroless plating, the addition of Gr reinforcing phase may reduce the stability of the plating solution, and the plating solution may be directly decomposed under high temperature (>50°C) conditions; 2) If Cu ions are to be realized Co-deposition with Gr requires that the two can coexist in the plating solution and be complexed together by the complex; 3) Gr or GO is easy to agglomerate and difficult to disperse in the plating solution, which affects its co-deposition with Cu ions

Method used

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  • Method for preparing copper-graphene compound plating layer, chemical plating solution and plating solution preparation method
  • Method for preparing copper-graphene compound plating layer, chemical plating solution and plating solution preparation method
  • Method for preparing copper-graphene compound plating layer, chemical plating solution and plating solution preparation method

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Embodiment 1

[0044] A kind of electroless plating method prepares the plating solution of Cu-Gr composite plating layer, calculates by every liter of composite plating solution, its component and content are as follows:

[0045]

[0046]

[0047] Above-mentioned electroless plating method prepares the plating solution of Cu-Gr composite coating by the method preparation of following steps:

[0048] Sodium citrate dihydrate, copper sulfate pentahydrate, sodium hypophosphite monohydrate, boric acid, and nickel sulfate heptahydrate were sequentially added to distilled water to dissolve, and graphene oxide GO was added under stirring conditions, and then oxidized with 5% hydroxide The sodium solution adjusts the pH value to 9-9.5, and finally the plating solution is ultrasonicated for 1-3 hours to obtain a well-dispersed Cu-GO composite chemical plating solution.

Embodiment 2

[0060] A kind of electroless plating method prepares the plating solution of Cu-Gr composite coating, calculates by every liter of composite plating solution, and its component and content are as follows:

[0061]

[0062] The above-mentioned a kind of electroless plating method prepares the plating solution preparation method of Cu-Gr composite coating with embodiment 1.

Embodiment 3

[0075] A kind of electroless plating method prepares the plating solution of Cu-Gr composite coating, calculates by every liter of composite plating solution, and its component and content are as follows:

[0076]

[0077] The above-mentioned a kind of electroless plating method prepares the plating solution preparation method of Cu-Gr composite coating with embodiment 1.

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Abstract

The invention provides a method for preparing a copper-graphene compound plating layer, a chemical plating solution and a plating solution preparation method. Hydrophilic graphene oxide and a proper amount of complexing agent, stabilizer, reductant and the like are added into chemical plating solution, and a Cu-Gr compound chemical plating layer is formed on the surface of a workpiece. The invention can be used for solving the technical problem of poor workpiece surface corrosion resistance in the prior art. The method disclosed by the invention has the simpleness in operation and high repeatability, the form and the excellent performance of Gr can be kept, a wild phase function is realized in the compound plating layer so as to greatly improve plating layer performance, and the method hasa wide application prospect in fields including corrosion resistance, electronics, automobiles, chemical engineering, oceaneering, military projects and the like.

Description

technical field [0001] The invention belongs to the technical field of electroless plating, and in particular relates to a method for preparing a copper-graphene composite coating, an electroless plating solution and a method for preparing the plating solution. Background technique [0002] Electroless Plating, also known as Electroless Plating or Autocatalytic Plating, is a new type of metal surface treatment technology. It refers to the method of reducing the metal ions in the solution to deposit metal on the surface of the substrate with catalytic activity and forming a dense coating under the condition of no external current, according to the principle of redox reaction, and using a suitable reducing agent. The main difference between chemical deposition (or electroless plating) and electrodeposition (electroplating) is that the electrons of chemical deposition come from the reducing agent, while the electrons of electrodeposition come from an external power supply. Com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/38C23C18/18
CPCC23C18/1806C23C18/38
Inventor 潘春旭李思诗宋贡生
Owner SHENZHEN RES INST OF WUHAN UNIVERISTY
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