A thermally superconducting plate and a method of manufacturing the same

A technology of thermal superconductivity and deflectors, which is applied in the field of heat transfer, can solve the problems that aluminum radiators cannot meet the heat dissipation requirements of high heat flux density and high-power modules, and achieve enhanced thermal superconducting heat dissipation capabilities, large heat dissipation capabilities, and high heat dissipation. small resistance effect

Pending Publication Date: 2019-01-18
ZHEJIANG JIAXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a thermal superconducting plate and its manufacturing method, which is used to solve the problem that the aluminum heat sink in the prior art cannot meet the heat dissipation requirements of high heat flux density and high power modules The problem

Method used

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  • A thermally superconducting plate and a method of manufacturing the same
  • A thermally superconducting plate and a method of manufacturing the same
  • A thermally superconducting plate and a method of manufacturing the same

Examples

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Embodiment 1

[0089] see Figure 1 to Figure 9 , the present invention provides a thermal superconducting plate, the thermal superconducting plate includes: a first cover 11, a second cover 21 and at least one deflector 3; wherein, the second cover 21 includes a cover The main body 211 and the annular convex edge 212, the annular convex edge 212 is integrally connected with the cover plate main body 211; the first cover plate 11 is placed on the surface of the annular convex edge 212 away from the cover plate main body 211 , to form a sealed chamber (not shown) between the first cover plate 11 and the cover plate main body 211; the deflector 3 is located in the sealed chamber, and the deflector 3 includes several a convex portion 31 arranged at intervals along the first direction and extending along the second direction, wherein the first direction is perpendicular to the second direction, and the bottom of the convex portion 31 is adjacent to the first direction Integral connection, and t...

Embodiment 2

[0103] Please combine Figure 1 to Figure 9 refer to Figure 10 to Figure 14 , this embodiment also provides a thermal superconducting plate. The structure of the thermal superconducting plate described in this embodiment is roughly the same as that of the thermal superconducting plate described in Embodiment 1. The difference between the two lies in: this Compared with the thermal superconducting plate described in Embodiment 1, the thermal superconducting plate described in the embodiment is provided with at least one reserved gap 34 in the deflector 3, and at the same time, the thermal superconducting plate also At least one pad 6 is included or at least one stamping boss 8 is provided on the first cover 11 or the second cover 21 . Other structures of the thermal superconducting plate described in this embodiment are identical to those of the thermal superconducting plate described in Embodiment 1. Please refer to Embodiment 1 for details, and will not be repeated here.

...

Embodiment 3

[0108] Please combine Figure 1 to Figure 13 refer to Figure 15 and Figure 16 , this embodiment also provides a thermal superconducting plate. The structure of the thermal superconducting plate described in this embodiment is roughly the same as that of the thermal superconducting plate described in Embodiment 1. The difference between the two lies in: implementing The number of deflectors 3 described in the thermal superconducting plate described in Example 1 is one, while the number of deflectors 3 described in this embodiment is at least two, and the adjacent said deflectors 3, there is a gap between them, so as to form the first balance channel 51 of the heat transfer working medium 41 between the adjacent deflectors 3, and the first balance channel 51 extends along the first direction, that is, the The extension direction of the first balancing channel 51 is parallel to the first direction. Other structures of the thermal superconducting plate described in this embod...

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PUM

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Abstract

The invention provides a thermally superconducting plate and a manufacturing method thereof. The thermally superconducting plate comprises a first cover plate; The second cover plate comprises a coverplate main body and an annular convex edge, wherein the annular convex edge is integrally connected with the cover plate main body; A first cover plate is attached to a surface of the annular convexedge remote from the cover plate body to form a sealed chamber between the first cover plate and the cover plate body; At least one baffle plate is located in that sealed chamber; The air guide plateincludes a plurality of convex portions spaced apart in the first direction and extending in the second direction, the bottom of the adjacent convex portions in the first direction are integrally connected, and a gap is arranged between the inside of the convex portions and the adjacent convex portions so that the air guide plate, the first cover plate and the second cover plate form a sealing passage communicating with each other; The sealed channel is filled with heat transfer working fluid. The thermal superconducting plate of the invention has the advantages of good homogeneity of temperature, strong thermal diffusion ability, small thermal resistance, high heat dissipation efficiency, large heat dissipation ability, compact structure, small volume, light weight, wide application rangeand the like.

Description

technical field [0001] The invention belongs to the technical field of heat transfer, and in particular relates to a thermal superconducting plate and a manufacturing method thereof. Background technique [0002] With the rapid development of power electronics technology, the requirements for modularization, integration, lightweight, low cost and high reliability are getting higher and higher. Therefore, in solar inverters, uninterruptible power supplies (UPS), charging piles, power MosFET (metal oxide semiconductor field effect transistor), Diode (diode), IGBT ( Power devices such as insulated gate bipolar transistors), CPUs, GPUs (graphics processing units) and computing power boards. As the integration of these power components is getting higher and higher, the power density is also increasing, and the heat generated by themselves is also increasing during work, and the heat flux density is getting higher and higher. The conduction and dissipation of heat will cause the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/427H01L23/46
CPCH01L23/3672H01L23/427H01L23/46
Inventor 仝爱星
Owner ZHEJIANG JIAXI TECH CO LTD
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