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Stirring device for modifying of epoxy resin adhesive

A technology of epoxy resin and stirring device, which is applied to mixers with rotary stirring devices, accessories of mixers, transportation and packaging, etc., can solve the problems of inconvenient real-time adjustment of temperature and air pressure, poor stirring effect, etc. The effect of easy discharge and smooth transmission

Inactive Publication Date: 2019-01-18
WUHU HUANGSHANSONG IND FLOOR NEW MATERIAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a stirring device for epoxy resin adhesive modification, to solve the problem that the stirring effect of the stirring device in the above-mentioned background technology is poor, and it is not convenient to adjust the temperature and air pressure in real time

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  • Stirring device for modifying of epoxy resin adhesive
  • Stirring device for modifying of epoxy resin adhesive
  • Stirring device for modifying of epoxy resin adhesive

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] see Figure 1-4 , the present invention provides a technical solution: a stirring device for epoxy resin adhesive modification, including a device main body 1, a heating water tank 2, a heating coil 3, a water pump 4, a connecting pipe 5, a stirring chamber 6, an interlayer 7, Heat insulation layer 8, stirring paddle 9, transmission shaft 10, reducer 11, stirring motor 12, material outlet 13, material inlet 14, vacuum pump 15, pressure sensor 16, temper...

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Abstract

The invention discloses a stirring device for modifying of an epoxy resin adhesive. The stirring device comprises a device main body and a stirring bin, wherein a heating water tank is arranged on theside surface of the device main body; a water pump is arranged on the side surface of the heating water tank; the stirring bin is located in the device main body; an interlayer is arranged on the outer side of the stirring bin; stirring blades are arranged in the stirring bin; a speed reducer is arranged on each transmission shaft; a stirring motor is arranged on each speed reducer; a dischargingopening is formed in the lower part of the stirring bin; a feeding opening is formed in the upper part of the stirring bin; a pressure sensor is arranged at the upper part of the inner part of the stirring bin; and a temperature sensor is arranged on the side surface of the stirring bin. According to the stirring device disclosed by the invention, the interlayer is arranged, so that in the usingcourse of the device, through the interlayer, the stirring bin can be convenient to subjected to heating in water bath, and the heating of the stirring device is more uniform; besides, a heat insulation layer made from glass fiber materials is made, so that the dissipation of heat quantity can be effectively reduced, and external influence on internal temperature of the stirring device is reduced.

Description

technical field [0001] The invention relates to the technical field related to epoxy resins, in particular to a stirring device for modifying epoxy resin adhesives. Background technique [0002] Modified epoxy resin adhesives are also called composite epoxy adhesives. Because epoxy resins are brittle and have low impact and peel strength, they can only be used as structural adhesives after modification. The modification method is to add a sufficient amount of thermoplastic resin or Synthetic rubber to increase toughness and improve overall performance. Epoxy resin needs to be mixed evenly by stirring and additives during the modification process, but the existing stirring devices usually have poor stirring effect on viscous mixtures, and it is not convenient to modify Some temperature and air pressure conditions in the permanent stirring process are adjusted in real time, and the practicability of the existing stirring device is poor when stirring the epoxy resin adhesive. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01F15/00B01F7/16B01F7/18B01F15/06
CPCB01F27/85B01F27/90B01F35/2113B01F35/2115B01F35/3215B01F35/3204B01F2035/99B01F35/92B01F2101/36
Inventor 黄小虎
Owner WUHU HUANGSHANSONG IND FLOOR NEW MATERIAL CO LTD
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