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Method for plating copper and copper alloy coiled material with nickel

A copper alloy and coil technology, applied in the field of nickel plating on copper and copper alloy coils, can solve the problems of immaturity, inability to overcome the continuous electroplating process of coils, and the inability of production methods to meet customer requirements. solid effect

Inactive Publication Date: 2019-01-11
尼尔金属(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the production process of electronic products becomes more and more mature, the requirements for suppliers are also getting higher and higher. When the products need to be welded, the weight of the single chip is lighter, and the production speed is faster, the traditional production methods can no longer meet the needs of customers. Require
[0004] The traditional electroplating method cannot overcome the continuous electroplating process of coils. Although there are continuous electroplating production processes in the market, the process of electroplating nickel on copper alloy coils is not yet mature. Therefore, in order to realize continuous electroplating of coils The process still needs to overcome technical difficulties

Method used

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Embodiment Construction

[0022] In the prior art, the raw materials are stamped and then electroplated with nickel for monolithic shaped products.

[0023] The invention electroplates metal nickel on the surface of copper material through a special electroplating process, and forms a firmly bonded, semi-bright and bright, dense, uniform and continuous coating on the surface of copper or copper alloy. The surface of the electroplated copper or copper alloy has the characteristics of nickel and the advantages of copper, and can be widely used in components of electronic products such as mobile phones and computer communications.

[0024] In the method of the present invention, the electroplating of copper or copper alloy coils is carried out in a bath-type electroplating device. The tank-type electroplating device is made of very corrosion-resistant metal materials. The entire device is several meters or even tens of meters long. According to the needs of the electroplating process, the device is divide...

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PUM

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Abstract

The invention discloses a method for plating a copper and copper alloy coiled material with nickel. After the coiled material is unfolded, the method sequentially comprises the following continuous steps that 1, the surface of the coiled material is subjected to degreasing and oil removing; 2, the surface of the coiled material is subjected to acid pickling; 3, the surface of the coiled material subjected to acid pickling is electroplated with a nickel layer, wherein the coiled material is adopted as a cathode, a nickel ball is adopted as an anode, the coiled material is soaked in a mixed solution including nickel aminosulfonate, nickel chloride, boric acid, a nickel softening agent, a nickel brightener and a phosphorus containing additive, and cleaning is carried out with purified water one or more times; 4, a purifying process is carried out, wherein the nickel layer is protected; 5, coating treatment is carried out, wherein micropores in the surface of the nickel layer are blocked off through organic matter; and 6, the coiled material is blown and dried. According to the method, a continuous electroplating process,of the copper and copper alloy coiled material, namely, a processof electroplating the copper coiled material with nickel is achieved, and the matte or bright, dense, uniform and continuous clad layer firm in combination is formed on the surface of the copper material. The electroplated surface of the copper material has the characteristic of nickel, and meanwhile the beneficial effects of the copper materials are achieved.

Description

technical field [0001] The invention relates to a method for plating nickel on a metal substrate, in particular to a method for plating nickel on copper and copper alloy coils, and belongs to the technical field of metal surface processing. Background technique [0002] The electroplating process is the process of plating a thin layer of other metals or alloys on the metal surface using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation (such as Rust), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance and enhance the appearance. [0003] The traditional electroplating production method is: first find material manufacturers to purchase materials, then go to stamping and forming, then electroplating, and finally return to users. This method adds additional intermediate links, transportation costs, time costs, etc. As ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/12C25D5/34C25D5/48C25D7/06
CPCC25D3/12C25D5/34C25D5/48C25D7/0614
Inventor 黄振成
Owner 尼尔金属(苏州)有限公司
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