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Polymer resin composition and application thereof to high-frequency circuit boards

A polymer and composition technology, applied in the direction of circuit substrate materials, applications, printed circuits, etc., can solve the problems of high cross-linking density, high brittleness, large dielectric constant and dielectric loss of the substrate, etc., and achieve thermal expansion coefficient The effect of low, low dielectric loss and low dielectric constant

Active Publication Date: 2018-12-25
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the vinyl structure selected by the resin has the following problems: 1. For the allyl group, due to the conjugation of its free radical intermediate, it does not have the activity of free radical curing; 2. For the acryloyl and methacryloyl groups, due to this The two vinyl active groups contain a certain polar carbonyl chemical structure, which will cause the dielectric constant and dielectric loss of the prepared substrate to increase; 3. For isobutenyl and vinyl, although they do not contain polar chemical structures, isobutylene radicals and vinyl groups need to initiate polymerization under the condition of peroxide radical initiators, and peroxide radical initiators are polar, which will increase the dielectric constant and dielectric loss of the substrate
However, the base material prepared by the composition containing vinylbenzyl ether modified poly(p-hydroxystyrene-styrene) polymer resin has high crosslinking density and high brittleness, which cannot meet the toughness requirements of copper clad laminates, so it is also necessary to Improvement of brittleness of poly(p-hydroxystyrene-styrene) polymer resin composition modified with vinylbenzyl ether

Method used

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  • Polymer resin composition and application thereof to high-frequency circuit boards
  • Polymer resin composition and application thereof to high-frequency circuit boards
  • Polymer resin composition and application thereof to high-frequency circuit boards

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0087] Synthesis of Vinylbenzyl Ether Modified Poly(p-Hydroxystyryl-styrene) Polymer SY-1:

[0088] Dissolve S-1 containing 1 mol of phenolic hydroxyl group in ethanol solvent, stir until it is completely dissolved, heat up to 50°C, and blow nitrogen gas for 30 minutes; add 1.2 mol of sodium methoxide and react for 1 hour; add 1.2 mol of vinylbenzyl chloride , reacted for 8 hours; after the reaction, the product was precipitated from ethanol, added toluene for dissolution, and washed 1 or 2 times; then dropped into ethanol to precipitate, and the precipitated product was dissolved in toluene to obtain vinyl benzyl ether modified poly(p- Hydroxystyryl-styrene) polymer SY-1, ready for use.

preparation example 2

[0090] Synthesis of vinylbenzyl ether modified poly(p-hydroxystyrene-styrene) polymer SY-2:

[0091] Dissolve CST15 containing 1 mol of phenolic hydroxyl group in ethanol solvent, stir until it is completely dissolved, heat up to 50°C, and blow nitrogen gas for 30 minutes; add 1.2 mol of sodium methoxide, and react for 1 hour; add 1.2 mol of vinylbenzyl chloride, and react 8 hours; after the reaction, the product was precipitated from ethanol, dissolved in toluene, washed once or twice with water; then dropped into ethanol to precipitate, and the precipitated product was dissolved in toluene to obtain vinyl benzyl ether modified poly(p-hydroxyphenyl Vinyl-styrene) polymer SY-2, ready for use.

preparation example 3

[0093] Synthesis of Vinylbenzyl Ether Modified Poly(p-Hydroxystyryl-styrene) Polymer SY-3:

[0094] Dissolve CST50 containing 1 mol of phenolic hydroxyl group in ethanol solvent, mechanically stir until it is completely dissolved, heat up to 50°C, and pass nitrogen gas for 30 minutes; add 1.2 mol of sodium methoxide, and react for 1 hour; add 1.2 mol of vinylbenzyl chloride, and react 8 hours; after the reaction, the product was precipitated from ethanol, dissolved in toluene, washed once or twice with water; then dropped into ethanol to precipitate, and the precipitated product was dissolved in toluene to obtain vinyl benzyl ether modified poly(p-hydroxyphenyl Vinyl-styrene) polymer SY-3, ready for use.

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Abstract

The invention relates to a vinyl benzyl ether modified poly(p-hydroxystyrene-styrene) polymer resin composition and further relates to a prepreg containing the resin composition and application of theprepreg to high-frequency circuit boards. The resin composition comprises (1) vinyl benzyl ether modified poly(p-hydroxystyrene-styrene) polymer resin and (2) olefin resin, wherein the weight ratio of additive butadiene of 1 and 2 sites in a molecular structure of the olefin resin is smaller than 20%. Besides having comprehensive performances including low dielectric constant, low dielectric loss, low thermal expansion coefficient and the like, a substrate prepared from the resin composition is small in cross-shaped mark area under the action of drop hammer impact loads, high in toughness andcapable of meeting the requirement of copper-clad plates on toughness.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a resin composition and its application in high-frequency circuit boards, in particular to a vinyl benzyl ether modified poly(p-hydroxystyrene-styrene) polymer Resin composition and its application in high frequency circuit board. Background technique [0002] In recent years, with the rapid development of wireless communication technology and electronic products, electronic circuits have entered the stage of high-speed information processing and high-frequency signal transmission; however, when the frequency is greater than 300MHz, or even above GHz, the electrical properties of the substrate will be seriously affected. The characteristics of electronic circuits put forward higher requirements on the performance of substrates. [0003] In terms of dielectric constant performance, in high-frequency circuits, the transmission rate of the signal is related to the die...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L25/18C08L25/06C08L25/10C08K5/14B32B15/04H05K1/03
CPCB32B15/04B32B2457/08C08L25/06C08L25/18C08L2203/20C08L2205/03C08L2205/06H05K1/0366C08L25/10C08K5/14H05K1/03
Inventor 陈广兵曾宪平徐浩晟关迟记
Owner GUANGDONG SHENGYI SCI TECH
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