Controllable preparation method based on high-stacking-degree graphene modified high-thermal-conductivity carbon-plastic alloy

Abstract

The invention discloses a controllable preparation method based on high-stacking-degree graphene modified high-thermal-conductivity carbon-plastic alloy. The carbon-plastic alloy is prepared from thefollowing components in percentage by weight: high-stacking-degree graphene filler: 5 to 50%, thermosetting resin: 30 to 55%, a coupling agent: 0.2 to 2%, a resin diluent: 1 to 5%, a curing agent: 7 to 15%, reinforcing filler: 5 to 20%, and an auxiliary agent: 2 to 5%. The high-stacking-degree graphene filler is composed of carbon materials of four different specifications, wherein graphene A accounts for 5 to 15%, graphene B accounts for 2 to 5%, nanographite microchip C accounts for 15 to 45%, and nanographite microchip D accounts for 35 to 78%. The high-stacking-degree graphene filler is added to a thermosetting resin matrix to form a perfect heat transfer passage, and the high-thermal-conductivity carbon-plastic alloy material having a thermal-conductivity coefficient of 10-25 W / m.K can be controllably prepared. The high-thermal-conductivity carbon-plastic alloy prepared by the invention can be processed into various heat dissipation components by compression molding or injection molding, and is suitable for industrial heat dissipation, illumination heat dissipation, heat dissipation of electronic devices, etc.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting materials, and in particular relates to a controllable preparation method based on high-packing-degree graphene-modified high-heat-conducting carbon-plastic alloy. Background technique [0002] As an important polymer compound material, plastic has a wide range of applications. Due to its advantages of high design freedom, easy processing and low cost, etc., plastics are gradually being used to replace metal applications. However, compared with the high thermal conductivity of metals, the thermal conductivity of plastics is generally poor. The application of plastics in the field of heat conduction and heat dissipation is limited. [0003] Graphene is a new type of two-dimensional carbon material that has been found to be the thinnest, the strongest, and the most conductive and thermally conductive. The thermal conductivity of graphene is as high as 5300W / m·K, which is much higher than t...

AI Technical Summary

Problems solved by technology

The physical exfoliated graphene has a wide particle size and layer distribution, and is limited to graphene with a single mesh when used, and the thermal conductivity of the obtained composite material is not high, and it is in the same level range

Graphene with a single size has the following problems in heat conduction applications: small-sized graphene has a large contact thermal resistance, requires a relatively high amount of fillers, high cost, and has a great impact on the mechanical properties of composite materials; large and medium-sized graphene is easy to Form a heat conduction path, but the degree of stacking is small, and it is easy to generate gaps, resulting in an insufficient heat conduction network and low heat conduction value

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