Wafer cutting machine with dust removal mechanism

Abstract

The invention belongs to the field of semiconductor wafer machining, and particularly discloses a wafer cutting machine with a dust removal mechanism. The wafer cutting machine comprises a machine frame; the machine frame is provided with a wafer placement table; a cutting mechanism is arranged on the wafer placement table; one side of the wafer placement table is provided with the dust removal mechanism; the dust removal mechanism comprises a first supporting seat and a second supporting seat which are transversely and slidably connected to the machine frame; a transverse rubber rod is connected to the first supporting seat, and a transverse glass rod is connected to the second supporting seat; the position, above the rubber rod, of the machine frame is transversely and slidably connectedwith a fur friction layer; the machine frame is provided with a fur driving mechanism used for driving the fur friction layer to transversely slide; the position, above the glass rod, of the machineframe is transversely and slidably connected with a silk friction layer attached to the top of the glass rod; and the machine frame is provided with a silk driving mechanism used for driving the silkfriction layer to transversely slide. Through the wafer cutting machine, the effect that dust is removed while a wafer is cut can be achieved, and the situation that the follow-up wafer detection result is influenced due to the fact that dust adheres to the cut wafer is avoided.

Description

technical field [0001] The invention relates to the field of semiconductor wafer processing, in particular to a chip cutting machine with a dust removal mechanism. Background technique [0002] In the electronics industry, a wafer is a collective term for thin sheets of semiconductor material used to manufacture integrated circuits or other micro-devices, also known as silicon wafers, substrates, etc. Wafers are processed into bare chips of integrated circuits, which need to go through many demanding and precise processes. In general, the process flow of wafers is generally divided into front-end process and back-end process in the industry. The front-end process mainly refers to the formation of crystals on the wafer and some technological processes adopted to realize crystal formation; the back-end process mainly refers to the process of passing the wafer with the generated circuit through a series of post-processes to process the wafer into a The process during the circ...

AI Technical Summary

Problems solved by technology

Dust will be generated during cutting, and the cut products will directly enter the optical inspection equipment for inspection. The dust attached to the product will easily affect the inspection results and be judged as unqualified by the system. At the same time, it will affect the inspection lens. The dust will be adsorbed on the lens. Maintenance and testing equipment

In the prior art, in order to eliminate the influence of dust on the chip, the measures taken are to wash the chip with water or cutting fluid to clean it, but water or cutting fluid will adversely affect the cutting process of the chip, thereby affecting the chip after cutting. the quality of

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