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Heat-conducting gasket and preparation method thereof

A heat-conducting gasket, insulating and heat-conducting technology, applied in the field of materials, can solve the problems that cannot meet actual use requirements, the improvement of thermal conductivity is difficult to be effectively controlled, and the dispersion state and distribution form of graphene cannot be effectively controlled, etc. Conductivity anisotropy, meet the test requirements of breakdown voltage, meet the effect of high thermal conductivity

Inactive Publication Date: 2018-11-30
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing graphene-added thermally conductive silicone gaskets are basically products obtained by directly blending graphene and other thermally conductive fillers into the base rubber. The dispersion state and distribution form of graphene in the product cannot be effectively controlled. As for the improvement of thermal conductivity, it is difficult to be effectively controlled, and the graphene exposed on the surface will make the thermal pad have a certain degree of conductivity, which cannot meet the actual use requirements.

Method used

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  • Heat-conducting gasket and preparation method thereof
  • Heat-conducting gasket and preparation method thereof
  • Heat-conducting gasket and preparation method thereof

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preparation example Construction

[0026] The invention provides a method for preparing a thermal pad, comprising:

[0027] A) the template is dipped, sprayed or poured into the graphene dispersion, and dried to obtain a composite template structure of graphene;

[0028] B) removing the template from the template structure to obtain a three-dimensional membranous graphene network structure;

[0029] C) filling silica gel containing insulating and thermally conductive fillers in the three-dimensional membranous graphene network structure to obtain a thermally conductive gasket sample;

[0030] D) Compounding the encapsulation layer on the thermal pad sample to obtain the thermal pad.

[0031] In the present invention, firstly, the template is dipped, sprayed or poured into the graphene dispersion.

[0032] The present invention firstly prepares a graphene dispersion liquid, the graphene dispersion liquid is preferably a graphene dispersion liquid treated with a coupling agent, and the coupling agent is prefera...

Embodiment 1

[0065] Get mass fraction and be 2.5% graphene dispersion liquid 200g, wherein oligomeric silsesquioxane content is 5% of graphene quality, casts the formwork (height 3mm, mesh spacing 2mm) of the diamond-shaped copper material that is suspended in the air, takes out Dry at 120°C. Repeated pouring 3 times, after thorough drying, soaked in 10% ammonium persulfate solution for 8 hours, the three-dimensional graphene film fell off from the template, washed three times with deionized water, and dried again at 120°C to test the graphene three-dimensional film. The average thickness of the film is 35um. Put it into a mold with a depth of 3mm, pour the silica gel mixture containing 90% alumina mixed evenly, heat at 60°C for 30min, and the silica gel will solidify and form. On the upper layer of the silica gel sheet, a layer of 20um thick silica gel mixture containing 1um alumina was coated, and the vertical and horizontal thermal conductivity of the sample were tested: 28.66W / (m*K) a...

Embodiment 2

[0067] Get mass fraction and be 2.5% graphene dispersion liquid 200g, silane coupling agent content is 10% of graphene quality, pours the template (height 3mm, mesh spacing 3mm) of the honeycomb copper material that places in suspension, takes out 100 ℃ of baking Dry. Repeated pouring 4 times, after thorough drying, soaked in 15% ammonium persulfate solution for 4 hours, the three-dimensional graphene film fell off from the template, washed three times with deionized water, and tested the average temperature of the three-dimensional graphene film after drying at 120 °C The thickness is 45um. Put it into a mold with a depth of 3 mm, pour 90% alumina mixed with a uniform silica gel mixture, heat at 120°C for 10 minutes, and the silica gel solidifies. The upper and lower layers of the silica gel sheet are each coated with a layer of silica gel mixture containing 2um alumina with a thickness of 10um. The vertical and horizontal thermal conductivity of the prepared samples are res...

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Abstract

The invention provides a preparation method of a heat-conducting gasket, which comprises the following steps: A) immersing a template, spraying and pouring a graphene dispersion liquid, drying to obtain a graphene compounded template structure; B) removing the template from the template structure to obtain a three-dimensional membrane graphene network structure: C) filling the three-dimensional membrane-shaped graphene network structure with slica gel containing a insulation heat condutiong filler to obtain heat-conducting gasket sample; D) compounding a packaging layer on the heat-conductinggasket sample to obtain the heat-conducting gasket. According to the preparation method, by adopting the graphene network structure containing the specific three-dimensional membrane, graphene sheetsin the network structure is closely arranged in sequence, so that the problem that the graphene is difficult in dispersion and the incomplete lapping joint of the graphene sheets is solved by forminga good heat-conducting loop. According to the preparation method, the ordered arrangement problem of graphene sheets is solved, so that the high heat-conducting efficiency requirement is met, the insulation problem is solved at the same time so as to meet the testing requirement of breakdown voltage.

Description

technical field [0001] The invention relates to the field of material technology, in particular to a heat conducting gasket and a preparation method thereof. Background technique [0002] With the development of various electronic devices in the direction of short, small, light and thin, the stacking density of miniaturized transistors has greatly increased, and the higher integration of electronic products means that electronic components packaged in circuit boards will produce more If the generated heat is not conducted in time, it will cause rapid accumulation of heat in electronic products, which will increase the operating temperature of electronic components, which will not only affect the normal working efficiency of the equipment, but also greatly shorten its service life . In order to ensure the normal operation of electronic components with high reliability for a long time, it is necessary to prevent the continuous rise of the operating temperature. Therefore, the...

Claims

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Application Information

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IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 丁世云周旭峰刘兆平
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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