Substrate for a manipulator

Abstract

A substrate for a manipulator includes a substrate and a substrate groove, A placing plate is fixedly mounted on the bottom end of the substrate, the bottom end of the placing plate is provided with aterminal part, one side of the substrate groove is provided with a receiving hole, and the receiving hole is fixedly connected with the substrate, A positioning groove is arranged above the substrategroove, an elongated groove hole is fixedly mounted on one side of the accommodation hole, a glass layer is fixedly mounted on the outer surface of the substrate, a resin layer is fixedly mounted onthe outer surface of the glass layer, a water-proof layer is fixedly mounted on the outer surface of the resin layer, and an anti-wear layer is fixedly mounted on the outer surface of the water-prooflayer. The substrate used for the manipulator is provided with an anti-slip strip, a resin layer and a waterproof layer, which can increase the stability of the equipment, prevent water inflow into the substrate, cause damage to the internal circuit, increase the flexibility of the substrate, prolong the use time of the substrate, and is suitable for different working conditions, thereby bringingabout better use prospects.

Description

technical field [0001] The invention relates to the field of mechanical equipment, in particular to a substrate for a manipulator. Background technique [0002] Substrate is the basic material for manufacturing PCB. In general, the substrate is copper-clad laminate. Single-sided and double-sided printed boards are manufactured on the substrate material-copper-clad laminate. Hole processing, chemical Copper plating, copper electroplating, etching and other processing to obtain the required circuit pattern. The manufacture of another type of multi-layer printed board is also based on the inner core thin copper clad laminate, and the conductive pattern layer and the prepreg are alternately laminated and bonded together at one time to form the interconnection between the conductive pattern layers of more than 3 layers. , it has three functions of conduction, insulation and support. The performance, quality, processability in manufacturing, manufacturing cost, manufacturing lev...

AI Technical Summary

Problems solved by technology

[0003] There are certain disadvantages in the use of existing substrates. First, the equipment is prone to looseness when connected for a long time, resulting in shortened service life of the equipment. Secondly, it is easy to absorb water and moisture, which leads to deformation of the substrate, which in turn reduces the performance of the circuit on the substrate. , the impact resistance is very poor, and it is easy to break, which has a certain impact on the use of the substrate. Therefore, we propose a substrate for manipulators

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