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Adhesive releasing method

A degumming method and degumming technology, applied in the field of degumming, can solve problems such as erosion of the surface of the pasted object and damage to the surface of the pasted object, and achieve the effect of appropriate peel strength, reduced peel strength, and high removal rate of residual glue

Active Publication Date: 2018-11-23
WEISHIDA SEMICON TECH ZHANGJIAGANG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the methods in the industry to remove the residual glue and degumming on the surface of the pasted object are to use organic solvents to wipe off the residual glue on the surface of the pasted object. Using organic solvents to wipe off the residual glue has the risk of eroding the surface of the pasted object, which is easy to cause Damaged surface

Method used

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Examples

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Effect test

Embodiment 1

[0032] The UV adhesive reducing film of the present embodiment comprises a substrate layer, a UV adhesive reducing adhesive layer and a release film layer which are laminated in sequence, wherein the material of the substrate layer is PVC, and the composition of the adhesive layer is as follows:

[0033] Acrylic glue (solid content is about 40%): 100 parts;

[0034] Photoinitiator TPO: 0.8 parts (ie 2% of the original gum solid content);

[0035] Isocyanate curing agent: 0.2 parts (that is, 0.5% of the original rubber solid content).

[0036] In addition, the thickness of the substrate layer is about 100 μm; the thickness of the UV adhesive reducing layer is about 20 μm; the thickness of the release film layer is about 38 μm.

[0037] The degumming method of this embodiment uses the above-mentioned UV mucous-reducing film to carry out the UV glue remaining on the surface of the SUS board, and the degumming steps are as follows:

[0038] Paste the above-mentioned UV mucous-re...

Embodiment 2

[0041] The UV adhesive reducing film of the present embodiment comprises a base material layer, a UV adhesive reducing adhesive layer and a release film layer which are laminated successively, wherein the material of the base material layer is EVA, and the composition of the adhesive layer is as follows:

[0042] Acrylic glue (solid content is about 40%): 100 parts;

[0043] Photoinitiator 1173: 1.2 parts (ie 3% of the original gum solid content);

[0044] Isocyanate curing agent: 0.32 parts (ie 0.8% of the original rubber solid content).

[0045] In addition, the thickness of the substrate layer is about 100 μm; the thickness of the UV adhesive reducing layer is about 25 μm; the thickness of the release film layer is about 50 μm.

[0046] The degumming method of the present embodiment adopts the above-mentioned UV mucous-reducing film to carry out the UV glue remaining on the surface of the glass plate, and the degumming steps are as follows:

[0047] Paste the above-mentio...

Embodiment 3

[0050] The UV adhesive reducing film of the present embodiment comprises a substrate layer, a UV adhesive reducing adhesive layer and a release film layer which are laminated in sequence, wherein the material of the substrate layer is PVC, and the composition of the adhesive layer is as follows:

[0051] Acrylic glue (solid content is about 40%): 100 parts;

[0052] Photoinitiator MBF: 0.4 parts (i.e. 1% of the original gum solid content);

[0053] Isocyanate curing agent: 0.24 parts (ie 0.6% of the original rubber solid content).

[0054] In addition, the thickness of the substrate layer is about 100 μm; the thickness of the UV adhesive reducing layer is about 22 μm; the thickness of the release film layer is about 40 μm.

[0055] The degumming method of this embodiment uses the above-mentioned UV mucous-reducing film to carry out the UV glue remaining on the surface of the SUS board, and the degumming steps are as follows:

[0056] Paste the above-mentioned UV mucous-reducin...

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Abstract

The invention provides an adhesive releasing method. The adhesive releasing method comprises the following steps of (A) sticking a UV (ultraviolet) visbreaking film to the surface requiring adhesive releasing; (B) radiating the UV visbreaking film by UV, and removing the UV visbreaking film, wherein the 180-degree releasing strength of the UV visbreaking film is 7 to 15N / 25mm before radiation by UV. The adhesive releasing method has the advantages that the residual adhesive at the surface of the adhered object can be efficiently and conveniently removed at lower risk, the adhesive releasing effect is good, and the residue rate of residual adhesive is low.

Description

technical field [0001] The invention relates to a degumming method, in particular to a degumming method using a UV mucous-reducing film. Background technique [0002] With the rapid development of the adhesive industry, anti-adhesive films have been widely used in the surface protection of semiconductors, lithium batteries and various modules. UV adhesion-reducing film is a special tape that has high peel strength during use and can quickly lose its adhesiveness after being irradiated by UV light. It usually plays a protective and supporting role by bonding and fixing wafer materials during processing. [0003] In scientific research and actual production, surface residual glue and degumming will inevitably occur. How to remove it efficiently and environmentally friendly has become a problem that people pay more and more attention to. At present, most of the methods in the industry to remove the residual glue and degumming on the surface of the pasted object are to use orga...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/30C09J133/12C09J11/06
CPCC09J7/30C09J11/06C09J133/12C09J2433/00C08K5/29
Inventor 崔庆珑喻佳敏
Owner WEISHIDA SEMICON TECH ZHANGJIAGANG
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