Ultra-low-expansion fluorine-containing polyimide thin film and preparation method and application thereof
A technology of polyimide film and polyimide, which is applied in the field of polyimide, can solve the problem of reducing the coefficient of linear thermal expansion, the mechanical properties of polyimide film, and the performance of water absorption rate, and the linear thermal expansion coefficient is not low enough. and other problems, to achieve the effect of reducing thermal expansion coefficient, low water absorption, and ultra-low linear thermal expansion coefficient
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Embodiment 1
[0055] (1) At room temperature and under the protection of an inert gas, add 19.12 grams (0.05 moles) of N,N'-bis(2-fluoro-4-aminophenyl) to a three-necked flask equipped with mechanical stirring, nitrogen inlet and outlet, and a thermometer Terephthalamide and 270 grams of N-methylpyrrolidone (NMP), stirred until completely dissolved; the system was lowered to a low temperature of -5°C, and 11.12 grams (0.051 moles) of 1,2,4,5-pyromellitic acid was added After the dianhydride was completely dissolved, it was stirred at low temperature for 18 hours to obtain a polyamic acid homogeneous solution with a solid content of 10 wt.%.
[0056] (2) The polyamic acid homogeneous solution polyamic acid homogeneous solution obtained in step (1) is filtered, vacuum defoamed, and then it is coated on a dry glass plate with a flat and smooth surface, placed in an oven and heated in a nitrogen atmosphere The curing is carried out at elevated temperatures, specifically 60°C / 2 hours, 180°C / 1.5 ...
Embodiment 2
[0060] (1) Under the protection of an inert gas, add 22.92 grams (0.0475 moles) of N,N'-bis(2-trifluoromethyl-4-aminophenyl ) terephthalamide and 110 grams of N,N'-dimethylacetamide (DMAc), stirred at room temperature until completely dissolved; lowered the system to a low temperature of 0°C, and added 13.41 grams (0.05 moles) of 2,3,6 , 7-naphthalene tetracarboxylic dianhydride (BNDA), after completely dissolving, stir at low temperature for 24 hours to obtain a polyamic acid homogeneous solution with a solid content of 25wt.%.
[0061] (2) The polyamic acid homogeneous solution polyamic acid homogeneous solution obtained in step (1) is filtered, vacuum defoamed, and then it is coated on a dry glass plate with a flat and smooth surface, placed in an oven and heated in a nitrogen atmosphere The curing is carried out at elevated temperatures, specifically 80°C / 1 hour, 200°C / 1 hour, and 350°C / 2 hours. After cooling down to room temperature, the substrate is soaked in deionized ...
Embodiment 3
[0065] (1) Under the protection of an inert gas, add 20.92 grams (0.05 moles) of N,N'-bis(2,5-difluoro-4-aminophenyl ) terephthalamide and 200 grams of N,N'-dimethylformamide (DMF), stirred at room temperature until completely dissolved; lowered the system to a low temperature of 5°C, and added 14.71 grams (0.05 moles) of 3,3,4 , 4-biphenyltetracarboxylic dianhydride (s-BPDA), was completely dissolved and stirred at low temperature for 20 hours to obtain a polyamic acid homogeneous solution with a solid content of 15wt.%.
[0066] (2) The polyamic acid homogeneous solution obtained in step (1) is filtered, vacuum defoamed, and then coated on a dry stainless steel plate with a flat and smooth surface, placed in an oven and heated in a nitrogen atmosphere The curing is carried out at elevated temperatures, specifically 100°C / 1 hour, 250°C / 2 hours, and 350°C / 1 hour. After cooling down to room temperature, the substrate is soaked in deionized water, the film is automatically peel...
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