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Silicon wafer cutting liquid circulation system and method adopting diamond wire

A technology of silicon wafer cutting fluid and circulation system, which is applied in the field of silicon wafer cutting and silicon wafer cutting fluid circulation system using diamond wire, can solve problems such as difficult recycling and complex cutting fluid components, so as to reduce energy consumption and avoid Deformation or corrosion, the effect of saving consumption costs

Inactive Publication Date: 2018-11-13
SHANDONG DAHAI NEW ENERGY DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, due to the complex composition of the cutting fluid, which contains organic components and carries the silicon powder generated during the cutting process, it is difficult to realize recycling

Method used

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  • Silicon wafer cutting liquid circulation system and method adopting diamond wire
  • Silicon wafer cutting liquid circulation system and method adopting diamond wire
  • Silicon wafer cutting liquid circulation system and method adopting diamond wire

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Embodiment Construction

[0050] In order to explain the overall concept of the present invention more clearly, the following will be described in detail by way of examples in conjunction with the accompanying drawings.

[0051] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

[0052] In addition, in the description of the present invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal" ", "Top", "Bottom", "Inner", "Outer", "Axial", "Radial", "Circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings , is only for the co...

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Abstract

The invention provides a silicon wafer cutting liquid circulation system adopting a diamond wire. The silicon wafer cutting liquid circulation system comprises a collection unit, a heat exchange unit,a filter-press separation unit and a clean liquid recycling unit. By adopting the silicon wafer cutting liquid circulation system, used cutting liquid from which silicon powder particles are separated can be recycled and used as cutting liquid again, and the cutting liquid carrying organic matters is prevented from entering wastewater for treatment, so that the treatment cost of wastewater is lowered, and the environment protection pressure is lowered. Meanwhile, the invention provides a silicon wafer cutting liquid circulation method adopting a diamond wire corresponding to the system.

Description

technical field [0001] The invention relates to material cutting, in particular to silicon chip cutting, in particular to a silicon chip cutting fluid circulation system and method using diamond wire. Background technique [0002] At present, the world's energy structure is developing in a certain direction. Although it is mainly based on non-renewable resources such as oil, coal, and natural gas, with the development of social economy, the development of new energy technologies, and the change of people's ideas, more and more attention has been paid to it. The application of new renewable resources, among which solar energy has the greatest development potential due to its clean and non-polluting advantages, and can be used as an energy source that can be almost infinitely developed. [0003] At this stage, the main way to utilize solar energy is to convert solar energy into thermal energy through heat collection, or to convert solar energy into electrical energy by using t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C02F9/10C02F103/34
CPCC02F1/001C02F1/02C02F2103/34C02F2301/08C02F2303/10
Inventor 刘坤韩志纯张良恒任文星吴勇侯永标
Owner SHANDONG DAHAI NEW ENERGY DEV
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