A semiconductor silicon wafer compounding device

Abstract

The invention belongs to the technical field of semiconductor manufacturing, in particular to a semiconductor silicon wafer glue homogenizing system, comprising a support plate, a dust blocking module, an electric cylinder, a first electric motor, a rotating rod, a glue homogenizing plate, a worktable and a vacuum generator, wherein the end of the electric cylinder rod is fixedly connected with anon-output end of the first electric motor; the rotating shaft end of the No. 1 motor is fixedly connected with one end of the rotating rod; The rotating rod is hinged with one end of a uniform rubberplate; a worktable is arranged below the even rubber plate; a vacuum generator is arranged below the middle part of the bottom plate of the worktable; between the worktable and the top plate of the support plate, a dust blocking module is arranged; the dust blocking module is used for preventing the surrounding dust from entering the space between the workbench and the top plate of the support plate. The invention is characterized in that a rubber homogenizing plate is arranged above the worktable, the No. 1 motor drives the rubber homogenizing plate to rotate steadily, the electric cylinderdrives the No.1 motor, the rubber homogenizing plate moves downward uniformly, and the rubber homogenizing plate uniformly spreads the glue liquid on the surface of the wafer, thereby realizing uniform and stable glue homogenization.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, in particular to a semiconductor silicon wafer compounding device. Background technique [0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Wafer is the carrier used in the production of integrated circuits. In general, wafers refer to single crystal silicon wafers. Wafers are the most commonly used semiconductor materials. The photolithography process includes steps such as wafer leveling, pre-baking, exposure, development, film hardening, corrosion, and degumming. Among them, the leveling is to make the photoresist distributed on the wafer uniform and reach a certain thickness, so that During exposure, the photoresist on the surface of the wafer can be properly photosensitive; when uniforming the glue, the motor is usually used to drive the wafer adsorbed on the vacuum chuck to rotate, so that the glue is evenly dist...

AI Technical Summary

Problems solved by technology

However, since the workbench may not be in a horizontal state during installation, the vacuum chuck is not in a horizontal state, so when the motor rotates, the centrifugal force generated by the suction cup is not in the direction of the horizontal plane, which will cause uneven distribution of the coating glue, resulting in wafer The thickness of the glue layer on the surface is different, which greatly affects the subsequent photolithography process, so there is an urgent need for a glue leveling solution realized in other ways

[0003] There are also some technical solutions for the manufacture of semiconductor silicon wafers in the prior art. For example, a Chinese patent with the application number 201721240564.8 discloses a wafer coating device for lithography machines, including a workbench, a fixed connection in the working The motor on the table and the vacuum suction cup horizontally arranged on the motor shaft also include an L-shaped support plate; a level is provided on the front of the workbench; the left side of the workbench is connected by a hinge shaft On the inner side of the vertical plate portion of the support plate; two horizontally arranged guide rails and a horizontally arranged threaded rod between the two guide rails are also provided on the inner surface of the vertical plate portion of the support plate, One end of the threaded rod is rotatably connected to the inner side of the vertical plate of the support plate through a bearing; this technical solution realizes that the entire workbench is in a horizontal state by adjusting the threaded rod, thereby ensuring uniform thickness of the coating glue, but this In the solution, the rotation of the motor above the workbench will vibrate, which will cause the upper suction cup to vibrate, affecting the uniformity of the glue layer; the fan installed above the wafer can only ensure that the air above the wafer is flowing, and does not remove dust from the source. It is blocked outside; use the centrifugal method to even the glue, and use the centrifugal force to throw the glue out. The surface of the glue can't be guaranteed to be a smooth plane, and the quality of the wafer can't be guaranteed 100%.

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