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High solid content polyimide coating glue and preparation method and use thereof

A technology of polyimide coating and high solid content, applied in the direction of adhesives, etc., can solve the problems of low transparency of PI coating, limited application, increase of coating viscosity, etc., achieve low dielectric constant, solve The effect of high dielectric constant

Pending Publication Date: 2018-11-06
CHINA UNIV OF GEOSCIENCES (BEIJING)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Further increasing the solid content will cause the viscosity of the coating to rise sharply, which cannot meet the construction requirements of chip passivation
Therefore, in order to achieve thicker passivation protective coating, multiple coatings are required, resulting in reduced device reliability and low production efficiency
Moreover, the curing temperature of polyamic acid (PAA) coating glue should reach or exceed 300°C, which limits its application in temperature-sensitive microelectronic or optoelectronic devices in many cases.
In addition, the soluble PI resins reported in the prior art often have a fully aromatic structure, resulting in low transparency and high dielectric constant of the PI coating, which limits its application in the field of optoelectronics

Method used

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  • High solid content polyimide coating glue and preparation method and use thereof
  • High solid content polyimide coating glue and preparation method and use thereof
  • High solid content polyimide coating glue and preparation method and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Embodiment 1 prepares soluble PI coating glue by HBPDA and TFMB

[0066] Add 32.023g (100mmol) TFMB and 150g m-cresol in a 1000mL three-necked flask equipped with a nitrogen inlet, water separator and thermometer, and stir until dissolved to form a homogeneous solution; add 30.631g (100mmol) HBPDA and 38g m-cresol solvent, after adding the material, stirred and reacted at 15°C for 20h to obtain a viscous polyamic acid (PAA) solution with a solid content of 25wt%. Add 3 g of isoquinoline and 350 g of toluene to the polyamic acid solution, heat and dehydrate for 3 hours, and then distill off the toluene. Adjust the reaction temperature to 180°C and react for 5h. Cool down, spin and pulverize to obtain polyimide (PI) resin powder. The structure of this PI resin is as follows:

[0067]

[0068] The molecular formula of the compound is shown in formula I, the number average molecular weight is 34901 g / mol, and the weight average molecular weight is 62945 g / mol; n=59. ...

Embodiment 2

[0076] Embodiment 2 prepares soluble PI coating glue by HBPDA and PIDA

[0077] Add 26.638g (100mmol) PIDA and 150g m-cresol in a 1000mL three-neck flask equipped with nitrogen inlet, water separator and thermometer, stir until dissolved to form a homogeneous solution; add 30.631g (100mmol) HBPDA and 22g m-cresol solvent, after adding the material, stirred and reacted at 15°C for 20h to obtain a viscous polyamic acid (PAA) solution with a solid content of 25wt%. Add 3 g of isoquinoline and 350 g of toluene to the polyamic acid solution, heat and dehydrate for 3 hours, and then distill off the toluene. Adjust the reaction temperature to 180°C and react for 5h. Cool down, spin and pulverize to obtain polyimide (PI) resin powder. The structure of this PI resin is as follows:

[0078]

[0079] The molecular formula of the compound is shown as formula II, the number average molecular weight is 58532 g / mol, and the weight average molecular weight is 106115 g / mol; n=109.

[00...

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Abstract

The application provides high solid content polyimide coating glue for chip passivation protection and a preparation method and use thereof, and relates to the technical field of chip passivation protection. The coating glue has high solid content and low viscosity and can be cured at a low temperature. The cured organic soluble polyimide glue coating has excellent dielectric properties, heat resistance and mechanical properties. The coating glue solves the problem that the existing polyamide acid coating glue has low solid content, high viscosity, a high curing temperature, poor heat resistance, poor transparency and high dielectric constant. The high solid content polyimide coating glue has wide application prospects in advanced microelectronics and optoelectronic devices.

Description

technical field [0001] The invention belongs to the technical field of chip passivation protection, and in particular relates to a high-solid-content polyimide (PI) coating adhesive for chip passivation protection and a preparation method and application thereof. Background technique [0002] In recent years, polyimide varnish (PI varnish) has been widely used in the fields of microelectronics and optoelectronics. For example, in the field of microelectronics, PI coating glue is widely used in the passivation protection of integrated circuit chips and discrete devices, stress buffering and interlayer insulation of multilayer wiring; in the field of optoelectronics, PI coating glue is widely used as thin film The transistor drives the liquid crystal alignment layer of the liquid crystal display (TFT-LCD), the insulating layer and the flexible OLED substrate of the organic electroluminescence display device (OLED), etc. With the rapid development of microelectronics and optoe...

Claims

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Application Information

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IPC IPC(8): C09J179/08C08G73/10
CPCC08G73/1007C08G73/1057C08G73/1078C09J179/08
Inventor 刘金刚武晓张燕郭晨雨张瑶佳职欣心
Owner CHINA UNIV OF GEOSCIENCES (BEIJING)
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