Curing method for photosensitive resin BCB

Abstract

The invention belongs to the technical field of production of semiconductor chips, and in particular relates to a curing method for photosensitive resin BCB. The method comprises the following steps of coating photosensitive BCB glue on the surface of an epitaxial wafer, forming a photosensitive BCB glue pattern on the surface of the epitaxial wafer by using a photoetching method; 2, etching the photosensitive BCB glue on the surface of the epitaxial wafer via a plasma reaction; 3, placing the etched epitaxial wafer into an annealing furnace, inputting the mixed gas of H2 and Ar for protection, raising the temperature from 50 DEG C to 275 DEG C in a multistage warming and heat-retaining manner, and keeping warm for 2h at the temperature of 275 DEG C; and 4, then increasing the flow for inputting the mixed gas of H2 and Ar to quickly reduce the temperature of the annealing furnace to the room temperature, and stopping inputting the mixed gas of H2 and Ar, thus completing curing. According to the curing method for the photosensitive resin BCB provided by the invention, the multistage warming and heat-retaining manner is used, so that the BCB polymerization reaction is more sufficient; and when in annealing, the mixed gas of H2 and Ar is used for replacing traditional N2 to serve as a protection gas, so that the possibility of oxidation and aging is reduced, and the BCB quality isimproved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor chip manufacturing, especially the high-speed and high-frequency chip part of high-end products, and specifically relates to a curing method of photosensitive resin BCB, which is used for making passivation layers and filling layers of chips. Background technique [0002] In the process of semiconductor chip processing, with the increase of frequency and speed, such as in the field of microelectronics processing and high-speed communication, the requirements for chip size, parasitic effect parameters, reliability, and insulation are getting higher and higher. The traditional processing passivation method can no longer meet the requirements of high-end products, and there is an urgent need for a material that can meet the processing of high-end chip products. BCB (benzocyclobutene) is a material with good performance that meets various requirements. This photosensitive photoresist has the cha...

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Problems solved by technology

[0004] The purpose of the present invention is to overcome the defects of the prior art, and provide a new curing method for photosensitive resin BCB, which can improve the quality of photosensitive BCB glue after formation, solve the problem of device BCB related failure caused by traditional methods, and then improve the overall performance of the chip. performance

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