Mask and production method thereof
A manufacturing method and mask technology, applied in the direction of ion implantation plating, metal material coating process, coating, etc., can solve the problem that the small size can only reach 25 μm to 40 μm, and the quality and accuracy of the metal mask are not very good. To meet the requirements of process requirements and other issues, to achieve the effect of reducing etching damage, reducing thickness, and improving the accuracy of through holes
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[0019] It can be seen from the background art that the quality and accuracy of the metal mask cannot well meet the requirements of the process.
[0020] In order to solve the technical problem, the present invention uses semiconductor processes such as deposition, photolithography and etching to make a mask. Compared with the metal mask made by traditional chemical etching, the semiconductor process can improve the The quality and accuracy of the through hole of the mask, thereby improving the quality and accuracy of the mask.
[0021] In order to make the above objects, features and advantages of the present invention more comprehensible, specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0022] figure 1 It is a structural schematic diagram of an embodiment of the mask plate of the present invention.
[0023] In this embodiment, the mask plate includes: a substrate 10, the substrate 10 includes a ...
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