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Anisotropic conductive film, connection method, and joined body

An anisotropic, conductive connection technology used in conductive adhesives, conductors, non-insulated conductors, etc.

Inactive Publication Date: 2018-09-28
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art described in Patent Document 2, it cannot be said that the curing of the metal wiring portion serving as the light-shielding portion is sufficient, and continuous improvement is desired for the adhesive strength.

Method used

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  • Anisotropic conductive film, connection method, and joined body
  • Anisotropic conductive film, connection method, and joined body
  • Anisotropic conductive film, connection method, and joined body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0132]

[0133]47 parts by mass of phenoxy resin (product name: PKFE, manufactured by Pakistan Industrial Co., Ltd.), 35 parts by mass of urethane acrylate (product name: EBECRYL600, manufactured by Daicel-Cytec Co., Ltd.), acrylic acid monomer (product name: A -DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) 5 parts by mass, silane coupling agent (product name: KBM-503, manufactured by Shin-Etsu Chemical Industry Co., Ltd.) 2 parts by mass, oxime ester type photopolymerization initiator (product name: IRGACURE OXE01, 3 parts by mass of BASF), 0.5 part by mass of anthracene, and 6 parts by mass of conductive particles (product name: AUL704, manufactured by Sekisui Chemical Co., Ltd., average particle diameter: 4 μm) were uniformly mixed. The mixed compound was coated on silicone-treated PET (polyethylene terephthalate) with a bar coater so that the average thickness after drying was 14 μm, and dried at 70° C. for 5 minutes. , making a conductive conductive fi...

Embodiment 2 to 3、 comparative example 1 to 4

[0150]

[0151] As shown in the following Table 1, in Example 1, except not adding anthracene or changing other compounds, it carried out similarly to Example 1, and obtained the anisotropic conductive film.

[0152] Evaluation was carried out in the same manner as in Example 1. The results are shown in Table 1.

[0153] [Table 1]

[0154]

[0155] In Examples 1-3, the result which was excellent in the conduction resistance was obtained both when it was exposed to a fluorescent lamp and when it was not exposed to a fluorescent lamp. In addition, the reaction rate after connection is high not only in the opening but also in the light-shielding part, and the adhesive strength is excellent.

[0156] Among them, both Examples 2 and 3 containing anthracene having a phenyl group as an additive exhibited particularly excellent adhesive strength.

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Abstract

The anisotropic conductive film connects a terminal of a first circuit member and a terminal of a second circuit member in an anisotropically conductive manner, and comprises a film-forming resin, a radical polymerizable compound, an oxime ester photopolymerization initiator, conductive particles, and a compound having an anthracene skeleton.

Description

technical field [0001] The present invention relates to an anisotropic conductive film, a connection method, and a bonded body. Background technique [0002] Conventionally, as a method of connecting electronic components and substrates, a tape-shaped connecting material (for example, anisotropic conductive film (ACF, Anisotropic Conductive Film)) in which a thermosetting resin dispersed with conductive particles is applied to a release film has been used. . [0003] This anisotropic conductive film is used, for example, to connect terminals of a flexible printed circuit board (FPC), an IC (Integrated Circuit, integrated circuit) chip, and an electrode formed on a glass substrate of an LCD (Liquid Crystal Display, liquid crystal display) panel. The state of connection includes the state of bonding and electrically connecting various terminals. [0004] Usually, a thermosetting resin is used for an anisotropic conductive film, and therefore, when hardening the said anisotro...

Claims

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Application Information

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IPC IPC(8): C09J7/30C09J7/10C09J4/00C09J9/02C09J11/04C09J11/06C09J201/00H01B1/22H01B5/16
CPCC09J4/00C09J9/02C09J11/04C09J11/06C09J201/00H01B1/22H01B5/16C09J7/10C09J7/30
Inventor 服部正明
Owner DEXERIALS CORP
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