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Anisotropic conductive film, connection method, and bonded body

An anisotropic, conductive connection technology, applied in the direction of conductive adhesive connection, connection, film/sheet adhesive, etc., can solve the problem that anisotropic conductive film cannot be obtained

Active Publication Date: 2018-07-20
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, in the prior art including the technology proposed above, an anisotropic conductive film that can be used for light irradiation using an LED having an emission wavelength of 365 nm and that can obtain sufficient connectivity even when exposed to indoor lighting cannot be obtained.

Method used

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  • Anisotropic conductive film, connection method, and bonded body
  • Anisotropic conductive film, connection method, and bonded body
  • Anisotropic conductive film, connection method, and bonded body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0133]

[0134] 47 parts by mass of phenoxy resin (trade name: PKFE, manufactured by Pakistan Industrial Co., Ltd.), 35 parts by mass of urethane acrylate (trade name: EBECRYL600, manufactured by Daicel Cytec Co., Ltd.), acrylic acid monomer (trade name: A -DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) 5 parts by mass, silane coupling agent (trade name: KBM-503, manufactured by Shin-Etsu Chemical Industry Co., Ltd.) 2 parts by mass, oxime ester type photopolymerization initiator (trade name: Irugakyua OXE01, manufactured by BASF Corporation) 3 parts by mass, IRGALITE RED CBNL (manufactured by BASF Corporation, 0.5 mass % toluene solution has a transmittance of 63% of light at a wavelength of 365 nm and a transmittance of 20% of light at a wavelength of 400 nm) 0.5 parts by mass, and 6 parts by mass of conductive particles (trade name: AUL704, manufactured by Sekisui Chemical Co., Ltd., average particle diameter: 4 μm) were uniformly mixed. Coat the mixed co...

Embodiment 2

[0150]

[0151] Except having changed 3 mass parts of oxime ester type photoinitiators into 6 mass parts in Example 1, it carried out similarly to Example 1, and obtained the anisotropic conductive film.

[0152] Evaluation was performed in the same manner as in Example 1. Table 1 shows the results.

Embodiment 3

[0154]

[0155] Except having changed 3 mass parts of oxime ester type photoinitiators into 1 mass part in Example 1, it carried out similarly to Example 1, and obtained the anisotropic conductive film.

[0156] Evaluation was performed in the same manner as in Example 1. Table 1 shows the results.

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Abstract

An anisotropic conductive film, enabling terminals of a first circuit part and terminals of a second circuit part to be connected in an anisotropic conductive manner, comprises film forming resin, a free radical polymerized compound, an oxime ester photopolymerization initiator, and a compound which is more than 40% in tranmissivity of light 365nm in wavelength and lower than 30% in tranmissivity of light 400nm in wavelength.

Description

technical field [0001] The present invention relates to an anisotropic conductive film, a connection method and a bonded body. Background technique [0002] Conventionally, as means for connecting electronic components and substrates, a tape-shaped connecting material (for example, anisotropic conductive film (ACF; Anisotropic Conductive Film)) in which a thermosetting resin in which conductive particles are dispersed is applied to a release film has been used. [0003] This anisotropic conductive film is mainly used, for example, to connect a terminal of a flexible printed circuit board (FPC) or an IC (Integrated Circuit) chip to an electrode formed on a glass substrate of an LCD (Liquid Crystal Display) panel. A case where various terminals are bonded to each other and electrically connected at the same time. [0004] Since a thermosetting resin is normally used for an anisotropic conductive film, when hardening the said anisotropic conductive film, heating at high temper...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/30C09J4/02H01R4/04H01R43/00
Inventor 冢尾怜司平山坚一
Owner DEXERIALS CORP
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