Adhesive for potting of integrated circuit board and preparation method thereof

A technology for integrated circuit boards and adhesives, applied in the direction of adhesives, adhesive additives, adhesive types, etc., can solve problems affecting the stability and reliability of integrated circuit boards, poor flame retardancy, and difficult heat dissipation, etc. The method is simple and easy to implement, the effect of improving performance stability and easy separation

Inactive Publication Date: 2018-09-28
湖州丘天电子科技有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its flame retardancy is poor, it is not easy to dissipate heat, and it is easy to age at high temperature, which affects the stability and reliability of the integrated circuit board.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive for potting of integrated circuit board and preparation method thereof
  • Adhesive for potting of integrated circuit board and preparation method thereof
  • Adhesive for potting of integrated circuit board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] An adhesive for encapsulating integrated circuit boards, comprising the following raw materials calculated in parts by weight:

[0024]

[0025] The preparation method of the modified polyurethane comprises the following steps: dissolving 40 g of polyurethane in 200 g of dimethyl sulfoxide, and adding 10 g of silane coupling agent KH560 and 30 g of tetrabutylammonium bromide to it, and stirring and reacting at 110° C. After 5 hours, wash with water 5 times, then dewater with anhydrous magnesium sulfate, filter and remove the solvent by rotary evaporation at 50°C;

[0026] The preparation method of the modified epoxy-terminated nitrile rubber comprises the steps of adding 30 g of epoxy-terminated nitrile rubber into 100 g of ethanol, and adding 1,3,5,7-tetrakis(4-amino) Phenyl)adamantane 10g, at 60°C

[0027] The reaction was stirred under low temperature for 6 hours, and then the solvent was removed by rotary evaporation at 50°C.

Embodiment 2

[0029] An adhesive for encapsulating integrated circuit boards, comprising the following raw materials calculated in parts by weight:

[0030]

[0031] The preparation method of the modified polyurethane comprises the following steps: dissolving 45 g of polyurethane in 230 g of N-methylpyrrolidone, and adding 13 g of silane coupling agent KH560 and 30 g of tetrabutylammonium bromide to it, and stirring at 113° C. React for 6 hours, then wash with water 6 times, then remove water with anhydrous magnesium sulfate, filter and remove solvent by rotary evaporation at 53°C;

[0032] The preparation method of described modified epoxy-terminated nitrile rubber comprises the steps of: adding 35 g of epoxy-terminated nitrile rubber in 120 g of isopropanol, and adding 1,3,5,7-tetrakis (4 -Aminophenyl)adamantane 10g, stirred and reacted at 65°C for 7 hours, and then removed the solvent by rotary evaporation at 53°C.

Embodiment 3

[0034] An adhesive for encapsulating integrated circuit boards, comprising the following raw materials calculated in parts by weight:

[0035]

[0036] The preparation method of the modified polyurethane comprises the following steps: dissolving 50 g of polyurethane in 270 g of N,N-dimethylformamide, and adding 17 g of silane coupling agent KH560 and 30 g of tetrabutylammonium bromide to it, Stir and react at 116°C for 7 hours, then wash with water for 7 times, then use anhydrous magnesium sulfate to remove water, filter and spin evaporate at 57°C to remove the solvent;

[0037] The preparation method of described modified epoxy-terminated nitrile rubber comprises the steps of: adding 40 g of epoxy-terminated nitrile rubber in 135 g of dichloromethane, and adding 1,3,5,7-tetrakis (4 -Aminophenyl)adamantane 10g, stirred and reacted at 72°C for 7.2 hours, and then removed the solvent by rotary evaporation at 56°C.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
tensile strengthaaaaaaaaaa
viscosityaaaaaaaaaa
Login to view more

Abstract

The invention discloses an adhesive for potting of an integrated circuit board and a preparation method thereof. The adhesive comprises the following raw materials by weight: 60 to 70 parts of modified polyurethane, 40 to 50 parts of modified epoxy-terminated nitrile rubber, 20 to 40 parts of fluorinated graphene and 2 to 5 parts of an accelerator, wherein the modified polyurethane is polyurethanemodified by a silane coupling agent KH560; and the modified epoxy-terminated nitrile rubber is epoxy-terminated nitrile rubber modified by 1,3,5,7-tetrakis(4-aminophenyl)adamantane. The adhesive disclosed by the invention has the advantages of simple and practicable raw material preparation method, low requirements for equipment, easily-available raw materials and low price; and the adhesive usedfor potting of the integrated circuit board and prepared by using the method provided by the invention has more excellent flame retardancy and high-temperature resistance and higher elongation at break, is easy for heat dissipation, and meets the usage requirements of the integrated circuit board for potting.

Description

technical field [0001] The invention relates to the technical field of integrated circuit board assembly, in particular to an adhesive for encapsulating integrated circuit boards. Background technique [0002] With the rapid development of electronic technology, integrated circuit boards have sprung up like mushrooms after rain. In order to further protect these integrated circuit boards and the components on them, and increase their reliability and stability, a layer of protective glue is usually covered on the surface, but the current integrated circuit boards, when processing modules, It is necessary to completely cut off the integrated circuit board and glue to separate the functional modules, especially for low temperature co-fired ceramics (LTCC). low efficiency. [0003] The adhesives in the prior art are easy to degumming during use, difficult to dissipate heat, easy to age under high temperature conditions, high elongation at break, and difficult to separate the g...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J115/00C09J11/06C09J11/04C08G18/83C08C19/40
CPCC08C19/40C08G18/833C08G18/837C08L2201/02C08L2201/08C08L2203/20C09J11/04C09J11/06C09J175/04C08L15/00C08K3/042C08K5/3445
Inventor 旷良彬
Owner 湖州丘天电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap