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Packaging method for sandwich type graphene-based heat-dissipating panel

A graphene-based, sandwich-type technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of difficult to guarantee welding reliability, high stress of welded components, easy penetration of aluminum alloy, etc., to reduce residual heat Effects of stress, increased strength, and increased shear strength

Active Publication Date: 2018-09-28
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems that the welding reliability is difficult to guarantee when the existing graphene-based heat sink is packaged, the stress of the welded components after welding is very large, and the aluminum alloy is easy to penetrate.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0009] Specific implementation mode one: this implementation mode is a packaging method of a sandwich-type graphene-based heat dissipation plate, which is specifically completed according to the following steps:

[0010] 1. Laser drilling: use laser etching technology to drill holes in the graphene, and the holes are evenly distributed to obtain graphene with holes;

[0011] 2. Surface metallization: assemble from top to bottom according to copper foil, silver-based solder, graphene with holes, silver-based solder and copper foil, and then vacuum braze to obtain metallized graphene;

[0012] 3. Assembly and packaging: embed metallized graphene into the frame, then assemble from top to bottom according to the way of aluminum plate, tin-based solder, metallized graphene, tin-based solder and aluminum plate, and then vacuum braze to get a sandwich type graphene-based heat sink.

[0013] This embodiment adopts laser etching technology to uniformly punch holes on the graphene surf...

specific Embodiment approach 2

[0019] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the graphene described in step 1 is a graphene plate with a length of 20 mm to 300 mm, a width of 20 mm to 300 mm, and a thickness of 0.5 mm to 5 mm. Others are the same as the first embodiment.

specific Embodiment approach 3

[0020] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is: the purity of the copper foil described in step 2 is 99.0-99.9%, the thickness is 20 μm-500 μm, and the length and width of the copper foil are the same as Graphene with holes has the same length and width. Others are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses a packaging method for a sandwich type graphene-based heat-dissipating panel and relates to a packaging method of a graphene-based heat-dissipating panel. The packaging methoddisclosed by the invention aims to solve the problem that the welding reliability is hard to guarantee, the stress of a post-welded welding member is great and an aluminum alloy is easy to penetrate when an existing graphene-based heat-dissipating panel is packaged. The packaging method comprises the following steps: I, laser perforating to obtain graphene with holes; II, surface metalizing to obtain metalized graphene; and III, assembling and packaging to obtain the sandwich type graphene-based heat-dissipating panel. The packaging method has the advantages that the room temperature shear strength of a joint between the metalized graphene and an aluminum panel after the graphene is packaged reaches over 7MPa. The packaging method disclosed by the invention is primarily used for graphene packaging.

Description

technical field [0001] The invention relates to a packaging method of a graphene-based heat dissipation plate. Background technique [0002] Due to the special physical properties and structural characteristics of three-dimensional graphene materials, there is still a long way to go from production to mass application of three-dimensional graphene materials. The packaging of graphene has become a major problem that researchers need to solve urgently. The main problems in the packaging of graphene-based materials are as follows: because the graphene plate has a layered structure, the interlayer bonding force is weak, which leads to the delamination of graphene under the thermal stress after welding, and the welding reliability is difficult to guarantee; when the welding area is large At the same time, due to the large difference in thermal expansion coefficient between graphene and aluminum alloy, the stress of the welded components after welding is very large; due to the low...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K28/02
CPCB23K28/02
Inventor 孙湛曹亮亮张丽霞冯吉才
Owner HARBIN INST OF TECH
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