Machine tool for processing wafer surface

Abstract

The invention discloses a machine tool for processing a wafer surface. The machine tool comprises a workpiece mounting table and a carrier which is detachably mounted on the workpiece mounting table.A millstone is arranged above the carrier. The millstone is mounted on the driving shaft of the machine tool and rotates along with the driving shaft of the machine tool. The millstone comprises a disc-shaped body. The central position of the lower end surface of the body is provided with a mounting trough. The mounting trough is internally provided with a sub-millstone. The lower end surface of the body is provided with a plurality of liquid feeding troughs which are uniformly distributed along the circumferential direction of the mounting trough. The liquid feeding troughs are used for accommodating mortar. In the inner wall of the liquid feeding trough, an inside wall which corresponds with the opposite direction of a body rotation direction is in transition connection with the lower end surface of the body. The machine tool for processing the wafer surface can satisfy a requirement for strength after wafer bonding and furthermore realizes quick and reliable wafer de-bonding process. The machine tool has advantages of high efficiency, high product qualified rate and low processing cost.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a machine tool for wafer surface processing. Background technique [0002] Thin wafers, especially thin wafers with a thickness less than 5mm, often need to be temporarily bonded to a carrier wafer during processing, so as to improve the strength of the functional wafer and facilitate processing, such as Thinning and grinding, etching, cutting, etc., and finally the functional wafer and the carrier wafer are separated to complete the processing of the functional wafer. [0003] It is not difficult to see that although this prior art can better solve the technical problem of weak and fragile thin wafer wafers, it additionally increases the loading wafer, which not only increases the process, reduces the production efficiency, but also increases the production efficiency of the wafer. Most of the wafers use engineering plastic boards, which are discarded directly after th...

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Problems solved by technology

[0003] It is not difficult to see that although this prior art can better solve the technical problem of weak and fragile thin wafer wafers, it additionally increases the loading wafer, which not only increases the process, reduces the production efficiency, but also increases the production efficiency of the wafer. Most of the wafers use engineering plastic boards, which are discarded directly after the functional wafers are cut. Therefore, the above-mentioned carrier wafers as one-time consumables will obviously lead to an increase in processing costs, which is not conducive to the popularization of mass production.

[0004] In addition, there are carrier wafers that can be recycled many times in the prior art, but the functional wafers and the carrier wafers in the prior art are bonded by bonding glue, so there are many problems in the process of removing the bonding glue. It is removed by chemical cleaning agent, mechanical stripping or local high temperature laser, etc. Obviously, the debonding process of these existing technologies will cause a certain degree of damage to the carrier wafer, so this kind of carrier wafer that can be recycled many times There is also a great limit to the number of times it can be used, so there is also the problem of high processing costs

[0005] It is not difficult to see that for the thin wafer processing of the prior art, the debonding process is the core technical problem that limits its production efficiency, product yield improvement and cost reduction

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