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Preparation method of lead-free electronic glass

A glass and electronic technology, applied in glass manufacturing equipment, glass molding, manufacturing tools, etc., can solve the problems of cumbersome manufacturing methods, low manufacturing efficiency, and high processing costs, and achieve shortened melting time, low cost, and high sealing strength. Effect

Inactive Publication Date: 2018-09-11
NANAN CHUANGPEI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The object of the present invention is to provide a method for preparing lead-free electronic glass, which has the advantages of fast processing speed, easy-to-obtain raw materials, high production efficiency, and high glass Mohs hardness, and solves the problems of cumbersome production methods, slow processing, low production efficiency, and low processing efficiency. High cost, high lead content is harmful to human body

Method used

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  • Preparation method of lead-free electronic glass

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Effect test

Embodiment 1

[0026] This embodiment provides a method for preparing lead-free electronic glass, and the specific steps are as follows:

[0027] S1: After mixing silicate and silicon dioxide, disperse at high speed by ultrasonic, the ultrasonic frequency is 50kHz, the dispersion speed is 5500r / min, and the dispersion time is 30 minutes. Then put it in a burning dish to melt, and add flux, The temperature in the combustion vessel is 1800℃;

[0028] S2: After melting for 20 minutes, until it does not contain unreacted batch particles to form a transparent glass liquid, add a glass clarifier to the transparent glass liquid to remove visible bubbles;

[0029] S3: Heat the glass liquid to homogenize it, eliminate streaks and other inhomogeneities, and make the chemical composition of each part of the glass consistent with expectations;

[0030] S4: Pour the molten glass into ionized water for quenching, filter to obtain filamentous vitreous powder, put the obtained vitreous powder into a crucible, then ...

Embodiment 2

[0034] This embodiment provides a method for preparing lead-free electronic glass, and the specific steps are as follows:

[0035] S1: After mixing silicate and silicon dioxide, disperse at high speed by ultrasonic, the ultrasonic frequency is 60kHz, the dispersion speed is 6000r / min, and the dispersion time is 60 minutes. Then it is melted in a burning dish, and flux is added. The temperature in the combustion vessel is 2000℃;

[0036] S2: After melting for 40 minutes, until it does not contain unreacted batch particles to form a transparent glass liquid, add a glass clarifier to the transparent glass liquid to remove visible bubbles;

[0037] S3: Heat the glass liquid to homogenize it, eliminate streaks and other inhomogeneities, and make the chemical composition of each part of the glass consistent with expectations;

[0038] S4: Pour the molten glass into ionized water for quenching, filter to obtain filamentous glass body powder, put the obtained glass body powder into a crucible...

Embodiment 3

[0042] This embodiment provides a method for preparing lead-free electronic glass, and the specific steps are as follows:

[0043] S1: After mixing silicate and silicon dioxide, disperse at high speed by ultrasonic, the ultrasonic frequency is 55kHz, the dispersion speed is 5750r / min, and the dispersion time is 45 minutes. Then put it in a burning dish to melt, and add flux, The temperature in the combustion vessel is 1900℃;

[0044] S2: After melting for 30 minutes, until it does not contain unreacted batch particles to form a transparent glass liquid, add a glass clarifier to the transparent glass liquid to remove visible bubbles;

[0045] S3: Heat the glass liquid to homogenize it, eliminate streaks and other inhomogeneities, and make the chemical composition of each part of the glass consistent with expectations;

[0046] S4: Pour the molten glass into ionized water for quenching, filter to obtain filamentous vitreous powder, put the obtained vitreous powder into a crucible, then ...

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Abstract

The invention discloses a preparation method of lead-free electronic glass. The preparation method comprises the following steps: S1: carrying out ultrasonic high-speed dispersion on a non-transparentsintered matter prepared from silicate and silicon dioxide, wherein the ultrasonic frequency is 50 to 60kHz, the dispersion speed is 5500 to 6000r / min and the dispersion time is 30 to 60min; then putting the non-transparent sintered matter into a combustion vessel and melting; adding a fluxing agent, wherein the temprature in the combustion vessel is 1800 to 2000 DEG C; S2: melting for 20 to 40min until the non-transparent sintered matter does not contain unreacted mixture particles, so as to form transparent glass liquid; adding a glass clarifying agent into the transparent glass liquid andremoving visible bubbles; S3: raising the temprature of the glass liquid to homogenize the glass liquid, and removing stripes and other non-uniform bodies, so as to enable chemical compositions of allparts of the glass to reach expectation. The glass prepared by the preparation method does not contain lead and has no damages to human bodies; the glass also has the advantages of high Moh's hardness, high sealing strength, high expansion coefficient, high light transmittance and good insulation performance; practical and industrial conditions are realized, and the glass can be widely applied toelectronics and electrical apparatus industries.

Description

Technical field [0001] The invention relates to the technical field of electronic glass preparation, in particular to a method for preparing lead-free electronic glass. Background technique [0002] Electronic glass (Electronic glass), also known as substrate glass, is a class of high-tech products used in the fields of electronics, microelectronics, and optoelectronics. It is mainly used to make integrated circuits and components with photoelectric, pyroelectric, acousto-optic, magneto-optical and other functional components. Glass materials are currently one of the most widely used and fastest-growing special glasses in high and new technologies such as microelectronics, optoelectronics and new energy. It mainly includes substrates for liquid crystal and solar cells, substrates for storage (disks and optical disks), and photomask substrates (also known as plate-making glass), which are photomasks for photolithography in the production of integrated circuits. [0003] After searc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B19/02C03C1/00C03C6/02C03C12/00
CPCC03B19/02C03C1/00C03C12/00
Inventor 王玉环
Owner NANAN CHUANGPEI ELECTRONICS TECH CO LTD
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