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Ceramic material laser scribing process method

A ceramic material, laser scribing technology, used in stone processing equipment, laser welding equipment, stone processing tools, etc., can solve the problems of high local reflectivity, irregular fracture, uneven energy absorption, etc., to achieve good process stability , Improve the quality of product processing, the effect of good practical value

Inactive Publication Date: 2018-09-11
WUHAN GSTAR TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Due to the high reflectivity of alumina ceramics to the 1064nm fiber laser, in the actual scribing process, either the scribing is completely cut, or the energy absorption is uneven due to the high local reflectivity, which makes the depth effect of the laser scribing unstable. or irregular fracture

Method used

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  • Ceramic material laser scribing process method

Examples

Experimental program
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Effect test

Embodiment 1

[0033] Embodiment 1: a kind of processing method of ceramic material laser scribing, comprises the following steps:

[0034] 1) Place the ceramic material to be processed on the adsorption platform of the fiber laser cutting machine and position it;

[0035] 2) Preset the cutting path and input the designed cutting path into the software;

[0036] 3) Set the laser processing parameters: in the state of positive focus position, the scribing speed is 200mm / s, the repetition frequency is 2800Hz, the pulse width is 0.1ms, and the peak power is 31.5W~45W when the power is 21%~30%;

[0037] 4) Start the fiber laser cutting machine, and laser scribe the ceramic material.

[0038] Such as Figure 1~4 As shown, the changes in the laser scribing depth of ceramic materials are as follows:

[0039] Such as figure 1 Shown: In step 3), when the peak power in the processing parameters is set to 21% power, that is, 31.5W, the obtained ceramic material laser scribing depth is 0.308mm, 0.3...

Embodiment 2

[0044] Embodiment 2: a kind of processing method of ceramic material laser scribing, comprises the following steps:

[0045] 1) Place the ceramic material to be processed on the adsorption platform of the fiber laser cutting machine and position it;

[0046] 2) Preset the cutting path and input the designed cutting path into the software;

[0047]3) Set the laser processing parameters: in the state of positive focus position, the scribing speed is 200mm / s, the pulse width is 0.1ms, the peak power is 39W, and the repetition frequency is 2400~2800Hz;

[0048] 4) Start the fiber laser cutting machine, and laser scribe the ceramic material.

[0049] Such as Figure 5~7 As shown, the changes in the laser scribing depth of ceramic materials are as follows:

[0050] Such as Figure 5 Shown: In step 3), when the repetition frequency in the processing parameters is 2400 Hz, the laser scribing depths of ceramic materials obtained are 0.335mm, 0.347mm, 0.337mm, 0.345mm, 0.349mm, 0.34...

Embodiment 3

[0054] Embodiment 3: a kind of processing method of ceramic material laser scribing, comprises the following steps:

[0055] 1) Place the ceramic material to be processed on the adsorption platform of the fiber laser cutting machine and position it;

[0056] 2) Preset the cutting path and input the designed cutting path into the software;

[0057] 3) Set the laser processing parameters: in the state of positive focus position, the scribing speed is 180~220mm / s, the pulse width is 0.1ms, the peak power is 39W, and the repetition frequency is 2400Hz;

[0058] 4) Start the fiber laser cutting machine, and laser scribe the ceramic material.

[0059] Such as Figure 8-10 As shown, the changes in the laser scribing depth of ceramic materials are as follows:

[0060] Such as Figure 8 Shown: In step 3), when the scribing speed in the processing parameters is 180 mm / s, the laser scribing depth of the obtained ceramic material is 0.490mm, 0.482mm, 0.490mm, 0.483mm, 0.480mm, etc.; t...

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Abstract

The invention discloses a ceramic material laser scribing process method. The ceramic material laser scribing process method comprises following steps that firstly, a ceramic material to be machined is placed on an absorbing platform of an optical fiber laser cutting machine, and positioning is carried out; secondly, a cutting path is preset, and the designed cutting path is input to software; thirdly, laser machining parameters are set, wherein under the focus exact position state, the scribing speed ranges from 180 to 220 mm / s, the pulse width is 0.1 ms, the peak power is 36 to 45 W, and therepeated frequency is 2400 to 2800 Hz; fourthly, the optical fiber laser cutting machine is started, and a ceramic material is subject to laser scribing. An optical fiber laser device is adopted to precisely scribe ceramic, under different process parameters of the control variate method, the machining technology is subject to experiment operation, through adjusting and optimizing of process parameter setting, the proper ceramic material laser scribing depth is obtained, product machining quality is improved, the process stability is good, market needs are met, and the good practical value isachieved.

Description

technical field [0001] The invention relates to the technical field of laser cutting, in particular to the technical field of a laser scribing processing method for ceramic materials. Background technique [0002] At present, engineering ceramic materials are one of the three pillars of modern engineering structural materials. Because of their special properties such as high strength, high hardness, high temperature resistance, wear resistance, chemical corrosion resistance, low density, and low thermal expansion coefficient, they are widely used in aerospace and automobile manufacturing. , Microelectronics and other industries are more and more widely used. Among them, high-performance alumina ceramic substrates are widely used as IC substrates and multilayer ceramic substrates in the electronics industry because of their special properties in terms of hardness, strength, insulation, and thermal conductivity. They are the new favorites of the IT industry. . [0003] There...

Claims

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Application Information

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IPC IPC(8): B23K26/362B28D1/22
CPCB23K26/361B28D1/22
Inventor 陈刚袁聪方小春
Owner WUHAN GSTAR TECH CO LTD
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