Laser chemistry-microwave ceramic preparation method

Abstract

The invention discloses a laser chemistry-microwave ceramic preparation method. According to the laser chemistry-microwave ceramic preparation method, the depth of conduction of heat generated by interaction between laser and ceramic into a substrate is reduced, so that the thickness of a recast layer produced due to heat melting and rapid cooling is reduced; a laser beam irradiates a ceramic sample, and the energy density at a focus of the laser beam exceeds a ceramic failure threshold, so that the ceramic at a cutting position is vaporized into ceramic particles; the vaporized ceramic particles are quickly removed by blowing in compressed air so as to avoid affecting subsequent machining. The ceramic prepared by the laser chemistry-microwave ceramic preparation method provided by the invention has the advantages of high specific surface area, high specific surface energy, high activity and easy sintering, so that the ceramic is easily cut; in addition, an adsorbent is used for adsorbing laser energy, so that the cutting efficiency is improved.

Description

technical field [0001] The invention relates to a preparation method, in particular to a preparation method of laser chemical microwave ceramics. Background technique [0002] The existing ceramic crack-free cutting method basically adopts (CO2 or Nd:YAG) laser, under the premise of constant single pulse energy, the pulse width is compressed to ns level, and the pulse frequency is increased to 10-20KHz level. Its obvious disadvantage is that it requires high equipment capacity, often requires multiple repeated cutting or pre-processing, and the practical cutting efficiency is low. With the increase of cutting speed, the slag changes from a flat shape to a directional corrugated shape; when cutting from low speed to high speed The reduction in the degree of superposition of individual pulses transforms the slag from a planar state to a discontinuous state. The cutting method is also converted from gasification and melting to fracture caused by additional partial thermal shoc...

AI Technical Summary

Problems solved by technology

However, ceramics are hard and brittle materials with poor thermal stability. When cutting, recast layers and cracks are easy to form, which reduces the original excellent performance of the substrate, and ceramics are reflective, so that the energy of the laser cannot be effectively gathered.