Method for preparing manganese-cobalt composite material by cathodic electrodeposition
A cathodic electrodeposition and composite material technology, which is applied in the direction of electrolytic inorganic material coating, etc., can solve the problems of anode slime generation in large quantities, and achieve the effects of reducing electroplating energy consumption, improving current efficiency, and high oxygen evolution catalytic activity
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Embodiment 1
[0028] (1) Preparation of electroplating solution
[0029] Add 0.2 mol of ammonium sulfate and 0.5 mol of sodium gluconate to 1L of deionized water, and after the ammonium sulfate and sodium gluconate are completely dissolved by ultrasonic stirring or glass rod stirring, add 0.5 mol of manganese sulfate monohydrate and 0.1 mol of cobalt sulfate, manganese sulfate monohydrate and cobalt sulfate are dissolved to obtain an electroplating solution, and ammonia or sulfuric acid is added to the electroplating solution until the pH of the electroplating solution is 3.
[0030] Among them, ammonium sulfate is used as a buffering agent, the concentration is 0.1-1mol / L; sodium gluconate is a metal ion chelating agent, the concentration is 0.1-1mol / L; manganese sulfate monohydrate is the sulfate salt introduced with manganese ions, the concentration is 0.3-0.6mol / L; cobalt sulfate is sulfate introduced with cobalt ions, the concentration is 0.05-0.2mol / L.
[0031] In addition to sodium...
Embodiment 2
[0049] (1) Preparation of electroplating solution
[0050] Add 0.4 mol of ammonium sulfate and 0.6 mol of sodium gluconate to 1L of deionized water, and after the ammonium sulfate and sodium gluconate are completely dissolved by ultrasonic stirring or glass rod stirring, add 0.4 mol of manganese sulfate monohydrate and 0.2 mol of cobalt sulfate, manganese sulfate monohydrate and cobalt sulfate are dissolved to obtain an electroplating solution, and ammonia or sulfuric acid is added to the electroplating solution until the pH of the electroplating solution is 3.2.
[0051] (2) Cathode substrate pretreatment
[0052] Use 400-mesh silicon carbide sandpaper, 800-mesh silicon carbide sandpaper, and 1200-mesh silicon carbide sandpaper to polish the stainless steel cathode in the same direction, and finally use 1500-mesh metallographic sandpaper to polish the stainless steel cathode to the mirror surface in the same direction. Place the polished stainless steel plate in absolute eth...
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