Ceramic substrate continuous laser cutting device and ceramic substrate continuous laser cutting method

Abstract

The invention discloses a ceramic substrate continuous laser cutting device and a ceramic substrate continuous laser cutting method, and relates to ceramic substrate cutting. According to the characteristics of a continuous silicon carbide film substrate, by utilizing a transmission device and laser cutting device combined mode, the continuous silicon carbide film substrate is cut under laser irradiation. In addition, with the combination of the characteristics of a ceramic film, certain pressure is applied to the two sides of a substrate cutting place through sponge, the continuous silicon carbide film substrate is endowed with certain intensity and the stress buffering function is played, so that the fragmentation problem of the continuous silicon carbide film substrate in the cut-off instant is solved, the continuous silicon carbide film substrate does not shift during cutting, and cut marks are burr-free. Under the driving of a transmission device, the continuous silicon carbide film substrate can be subjected to continuous cutting, so that automatic mechanical operation is realized, and the cutting efficiency is improved substantially. By replacing chain plates at different lengths, multiple continuous silicon carbide ceramic film substrates can be cut into the sizes required by components, so that an application of the continuous silicon carbide ceramic film substrates inpower-type semiconductor component packaging is realized.

Description

technical field [0001] The invention relates to ceramic substrate cutting, in particular to a ceramic substrate continuous laser cutting device and a cutting method thereof. Background technique [0002] Semiconductor power devices are developing in the direction of high power, high integration, and small size, and the requirements for various performances of heat dissipation substrates are also gradually increasing. Ceramic substrates are circuit boards based on high-efficiency heat dissipation and chemically stable ceramic materials, especially suitable for high-power electronic component packaging applications. Compared with traditional metal substrates (aluminum substrates, copper substrates, etc.), ceramic substrates overcome the problem of thermal stress caused by the mismatch of thermal expansion coefficients between the chip and the substrate, and do not require an additional insulating layer to overcome its conductivity. However, only when the substrate is cut into...

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Problems solved by technology

[0012] In view of the above problems, the purpose of the present invention is to provide effective automatic and continuous cutting for continuous ceramic thin films, greatly improve the cutting efficiency, cut the ceramic thin films, have neat cuts, high cutting precision, controllable cutting length, and solve the problem of hardness of ceramic thin film substrates. A continuous laser cutting device for ceramic substrates that is difficult to cut and easily broken at the moment of cutting

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