Preparation method of patterned metal layer
A patterning, metal layer technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of unclean metal removal, increased peeling difficulty, and inability to achieve peeling effect.
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[0017] The preparation method of the graphic metal layer provided by the present invention will be further described below.
[0018] The invention provides a method for preparing a patterned metal layer, the preparation method comprising:
[0019] Provide a base, and sequentially form primer and photoresist on the base;
[0020] exposing the substrate with the primer and the photoresist and placing it in a developing solution for simultaneous patterning, wherein in the developing solution, the dissolution rate of the primer is greater than that of the exposed photoresist ;
[0021] Depositing a metal layer on the substrate with patterned primer and photoresist;
[0022] peeling off the underlayer glue and the photoresist to obtain a patterned metal layer.
[0023] The material of the bottom layer glue is LOR glue, and the photoresist is positive photoresist. Described LOR glue is a kind of non-photosensitive water-soluble macromolecule polymer, and chemical change can not ...
Embodiment 1
[0038] refer to figure 2 The process flow chart, using silicon wafers as the substrate 1, first clean the silicon wafers with RCA standard cleaning solution and dry them: when cleaning, first wash the silicon wafers in a volume ratio of 4:1 2 SO 4 with H 2 o 2 Wash in 5 min, rinse in deionized water after cleaning, and then put in NH with a volume ratio of 1:1:5 4 OH / H 2 o 2 Wash in a solution of deionized water for 5 minutes, rinse in deionized water after cleaning, and then put in HCl / H with a volume ratio of 1:1:4 2 o 2 Wash in a solution of deionized water for 5 minutes, rinse in deionized water after cleaning, then put in HF with a concentration of 2% for 30 seconds, and rinse in deionized water after cleaning. After cleaning, the silicon wafers were put into a spin dryer and dried at a speed of 2000r / min for 5min.
[0039] Use LOR-5B photoresist as the primer 2 and spread it evenly on the silicon wafer twice, with a thickness of 0.7 μm each time and a total thic...
Embodiment 2
[0049] refer to figure 2 The process flow chart, using silicon wafers as the substrate 1, first clean the silicon wafers with RCA standard cleaning solution and dry them: when cleaning, first wash the silicon wafers in a volume ratio of 4:1 2 SO 4 with H 2 o 2 Wash in 5 min, rinse in deionized water after cleaning, and then put in NH with a volume ratio of 1:1:5 4 OH / H 2 o 2 Wash in a solution of deionized water for 5 minutes, rinse in deionized water after cleaning, and then put in HCl / H with a volume ratio of 1:1:4 2 o 2 Wash in a solution of deionized water for 5 minutes, rinse in deionized water after cleaning, then put in HF with a concentration of 2% for 30 seconds, and rinse in deionized water after cleaning. After cleaning, the silicon wafers were put into a spin dryer and dried at a speed of 2000r / min for 5min.
[0050] Use LOR-5B photoresist as the primer 2 and spread it evenly on the silicon wafer twice, with a thickness of 0.5 μm each time and a total thic...
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